JoVE Journal

Engineering

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Nanyang Technological University

Chapters in this video

0:05

Title

1:21

Fabrication of Hexagonal-closed-packaged (HCP) Overlayer of C84 in Si Substrate

2:57

Measurements of Electronic Properties of C84-embedded Si Substrate

5:07

Measurements of Surface Magnetism

6:17

Measurements of Nanomechanical Properties by AFM

6:49

Measurement of Nanomechanical Properties by Molecular Dynamics Simulation

11:05

Results: Characterization of C84-embedded Silicon Substrate by Nanomeasurements and Molecular Dynamic Simulation

12:46

Conclusion

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