Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

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10.0K Views

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08:46 min

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April 13th, 2016

DOI :

10.3791/53683-v

April 13th, 2016

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Holly D. Carlton¹, John W. Elmer¹, Yan Li², Mario Pacheco², Deepak Goyal², Dilworth Y. Parkinson³, Alastair A. MacDowell³

¹Materials Engineering Division, Lawrence Livermore National Laboratory, ²Assembly Test and Technology Development Failure Analysis Labs, Intel Corporation, ³Advanced Light Source, Lawrence Berkeley National Laboratory

Podsumowanie

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Keywords Synchrotron Radiation Microtomography

3D Imaging

Microelectronic Package

Non destructive Evaluation

Micrometer Scale

Sample Mounting

Sample Alignment

Magnification Selection

X ray Energy

Polychromatic Beam

Rozdziały w tym wideo

0:05

Title

1:28

Steps for Performing Tomography Scans at Beamline 8.3.2 (ALS, LBNL)

4:02

Setting up the Scan Parameters Using the Data Acquisition Computer

4:54

Results: Multi-scale Features Imaged in an Entire Micro-electronic Package Using Synchrotron Radiation Microtomography

6:11

Conclusion

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