This research is supported by the project entitled "Development of impact print-type hot embossing technology for a conductive layer using conductive nano-composite materials" through the Ministry of Trade, Industry and Energy (MOTIE) of Korea (N046100024, 2016).

1. Fabrication of the impact print-type hot embossing process
<ol>
	<li>Make model 1 and combine it with an X-stage (see Figure 1). 
	NOTE: It is recommended that Model 1 be made of aluminum to avoid heat being conducted onto the X-stage. Moreover, it is recommended that the length of Model 1 be the distance between the surface of the heat plate and the lowest height of the bearing plate of the Z-stage as the design of Model 1 varies with the size of the heat plate.</li>
	<li>Combine the X-stage and Z-stage and assemble the Z-stage and Model 2. 
	NOTE: Ensure that Model 2 is made of a metal that can endure the heat from the heat plate (e.g., aluminum). Fixing Model 2 to the Z-stage tightly will ensure the capability of the Z-stage to hold the weight of Model 2 and the impact header.</li>
	<li>Combine Model 2 and the impact header and place the heat plate below Model 1. 
	NOTE: Joining the impact header with the lowest position on Model 2 will ensure that the mover reaches the surface of the heat plate. It is recommended to install the heat plate after raising the Z-stage maximally to avoid any contact of the impact head with the surface of the heat plate. Use suitable software to control the stage.</li>
	<li>Convert the STL files of the film holder (Supplementary File 1 and Supplementary File 2) to GCODE files using suitable software to print the film holder with a three-dimensional (3D) printer. 
	NOTE: The software may vary with the 3D printer used, and some environments may support 3D printer environments without GCODE conversion.</li>
	<li>Use the 3D printer to print the film holder with the GCODE file. 
	NOTE: Using a filament (e.g., Z-HIPS) is recommended because less contraction will occur when printing large parts, such as the film holder.</li>
	<li>Install two film holders onto the end of the heat plate and fix the polymer film onto the film holder, as shown in Figure 1. To ensure that the polymer film is flat on the heat plate, pull the polymer film as much as possible using motion 1 of the film holder (see Figure 1B). To move the polymer film to the side, move the film holder via motion 2 (see Figure 1B). 
	NOTE: To fix the polymer film onto the film holder, it is recommended to use a screw. Glue is insufficient to affix the polymer film onto the film holder, and it is best for the detachment of the polymer film after the patterning experiment.</li>
</ol>
2. Fabrication of the control circuit
NOTE: This process describes the process of constructing the control circuit of the impact header and the X&#8211;Z stage.
<ol>
	<li>Connect the control device that sends the signals (see Table of Materials) to the impact header to control it.</li>
	<li>After connecting the control device to the impact header, input -3 V and +10 V as control signals into the impact header. 
	NOTE: If a +10 V control signal is sent to the impact header (see Figure 1), the mover (impact head) goes down and enters the turn-on state. In this state, the mover hits the polymeric film and engraves the pattern on the polymer film.
	<ol>
		<li>Raise the mover to engrave the next pattern after engraving a pattern using the mover of the impact header. To raise the mover (impact head), apply the -3 V control signal. 
		NOTE: A negative voltage is input to the impact header to prevent the mover from becoming magnetized by the inner remnant flux of the impact header.</li>
	</ol>
	</li>
	<li>If the control device cannot supply a sufficient control signal, use a high-power operation amplifier (e.g., OP-AMP) which amplifies the ~0 V&#8211;5 V control signal to ~-3 V&#8211;+10 V, as shown in Figure 2, to control the impact header.
	<ol>
		<li>First, prepare a dual-channel DC power supply (see Table of Materials). After this step, connect four nodes to provide common ground (GND) nodes to all channels: a positive voltage terminal (V1+) and a ground (GND) terminal for channel 1 and a negative voltage terminal (V2-) and ground (GND) for channel 2. An overall connection diagram is shown in Figure 2. 
		NOTE: According to the step described in 2.3.1, positive and negative voltage with different absolute values can be supplied to the operational amplifier (OP-AMP).</li>
		<li>Connect the negative voltage terminal of channel 1 (V1-) of the power supply to the negative power supply voltage terminal (Vs-) of the OP-AMP, as indicated by the blue line in Figure 2. Subsequently, input 3 V Vcc voltage to channel 1. 
		NOTE: According to step 2.3.1, the 3 V Vcc voltage is supplied as -3 V negative voltage to the negative power supply voltage terminal (Vs-) of the OP-AMP.</li>
		<li>Connect the positive voltage terminal of channel 2 (V2+) of the power supply to the positive power supply voltage terminal (Vs+) of the OP-AMP, as indicated by the red line in Figure 2. Subsequently, input 10 V Vcc voltage to channel 2. 
		NOTE: According to step 2.3.1, the 10 V Vcc voltage is supplied as +10 V positive voltage to the positive power supply voltage terminal (Vs+) of the OP-AMP.</li>
		<li>Connect the +output channel of a control device (Vcon+) to the positive input channel (Vin+) of the OP-AMP, as shown by the green line in Figure 2.</li>
		<li>Connect the -output channel of a control device (Vcon-) to the ground (GND) of channel 2 of the power supply, as shown by the black line in Figure 2. 
		NOTE: When connecting the (Vcon-) to the ground (GND), it is possible to connect it to one of the terminals connected during step 2.3.1 in addition to the GND of channel 2.</li>
		<li>Prepare electric resistance of 1 k&#937; and 10 k&#937; values in each case and connect them between the red line and black line, as shown in Figure 2.</li>
		<li>Connect the terminal between 1 k&#937; and 10 k&#937; to the negative input channel of the OP-AMP (Vin-), as shown by the purple line in Figure 2.</li>
		<li>Pull out the lines from the output channel of the OP-AMP (Vout) and one of the electrical terminals described in step 2.3.1. Connect the lines to the impact header, as shown by the orange line in Figure 2.</li>
		<li>Regarding the power supply, set the voltages of channel 1&#8211;3 Vcc and channel 2&#8211;10 Vcc. Subsequently, generate control signals of ~0 V&#8211;5 V from the control device. 
		NOTE: The generated ~0 V&#8211;5 V control signals will be amplified by the OP-AMP to ~-3 V&#8211;+10 V, which is necessary to control the impact header as described in steps 2.2.1 and 2.2.2.</li>
	</ol>
	</li>
</ol>
3. Experiment design
NOTE: This section describes the processes of controlling the impact-type hot embossing device and engraving dot patterns onto the polymer film.
<ol>
	<li>Install a stage-control program (e.g., Micromove) to control the X-stage and Z-stage using a control computer (PC).</li>
	<li>Install DAQ driver software to detect the control device on the control PC that controls the impact header and install an operating program (e.g., MATLAB) to control the control device.</li>
	<li>After installing the software, construct the hardware environment as shown in Figure 3A to conduct the patterning experiment.
	<ol>
		<li>Install the X stage, Z stage, impact header, film holder, and heat plate as shown in Figure 3A to construct the hardware environment.</li>
		<li>Fix the polymer film onto the film holder and adjust the position of the polymer film using motions 1 and 2 (see Figure 1B) to fix the film flatly. 
		NOTE: To keep the film flat while adjusting direction 2, the locations of the two film holders should be parallel. To make the film flat on the heat plate, it is recommended to adjust the film holder by lowering the position according to direction 1, as shown in Figure 1B.</li>
		<li>After fixing the polymer film, adjust the temperature of the heat plate to heat the film above the glass transition temperature. 
		NOTE: Each type of film has its own glass transition temperature. Therefore, it is recommended to adjust the temperature of the heat plate to its own glass transition temperature after checking the material properties of the film in the corresponding datasheet.</li>
	</ol>
	</li>
	<li>After setting the hardware, put the control circuit together as shown in Figure 3B to control the stage and the impact header.
	<ol>
		<li>Prepare the PC, control board, power supply, and OP-AMP to construct the control environment as shown in Figure 3B. Connect the devices as shown in Figure 2 and then connect the computer to the control board.</li>
		<li>Enter the 3 Vcc and 10 Vcc values into an OP-AMP through channels 1 and 2 of the power supply respectively, as described in step 2.3.9.</li>
	</ol>
	</li>
	<li>Control the stage and impact header using the control computer.
	<ol>
		<li>Adjust the initial position of impact header by controlling X and Z stages using the stage control program. 
		NOTE: While adjusting the initial position of the impact header, ensure that there is no collision between the impact header and the heat plate. If the position of the Z-stage is too low, the mover will collide with the heat plate, damaging both the mover and the heat plate. If there is damage to both devices, it will hinder the creation of fine patterns on a polymeric material.</li>
		<li>Using the operating program, generate a 5 V control signal from the control device. According to steps 2.3.1&#8211;2.3.9, the OP-AMP will amplify the 5 V control signal to +10 V, turn the impact header on, and engrave the patterns on the polymer film.</li>
		<li>Now generate a 0 V control signal from the control device using the operating program. According to steps 2.3.1&#8211;2.3.9, the OP-AMP will amplify the 0 V control signal to -3 V and turn the impact header off. 
		NOTE: The mover of the impact header will be raised, waiting to engrave the new pattern.</li>
		<li>Move the X-stage into position to engrave the next pattern.</li>
		<li>Engrave patterns 3x on the polymer film by repeating steps 3.5.1&#8211;3.5.4 sequentially.</li>
		<li>Lower the Z-stage 10 &#956;m from the initial position and execute step 3.5.5, counting the number of Z-stage moves. When the number of Z-stage movements exceeds three, move the X-stage to the initial position and raise the impact header maximally by moving the Z-stage. 
		NOTE: Changing the height of the Z-stage will ensure adjustments in the depth and width of the dot pattern.</li>
	</ol>
	</li>
	<li>Detach the polymer film from the film holder and measure the width and depth of each pattern using a confocal microscope (see Table of Materials), as shown in Figure 4A.
	<ol>
		<li>Before starting the measurement process, select the magnification value of the microscope and use the direct observation mode initially to adjust the scanning position of the polymer film. After adjusting the position by means of direct observation, fix the polymer film and change the scanning mode to the laser scanning mode. 
		NOTE: When using the confocal microscope, using an acrylic panel is recommended to fix the sample, as shown in Figure 4B.</li>
		<li>Using the laser scanning mode, measure the depth and width of the dot pattern.</li>
	</ol>
	</li>
	<li>Repeat steps 3.3.2&#8211;3.6.2 after changing the type of film. 
	NOTE: Considering the glass transition temperature of each type of film, set the temperature of the heat plate before placing each film on the heat plate. In this study, the glass transition temperature of PVC film is 100 &#176;C; for PMMA film it is 95 &#176;C, and for PET film it is 75 &#176;C.</li>
</ol>

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The authors have nothing to disclose

In this study, we implemented the impact print-type hot embossing process and engraved dot patterns with various widths and depths onto a range of polymer films in real time. Among the protocol steps, two steps should be critically considered among all steps. The first is the setting of the temperature of the heat plate (step 3.3.3), and the second is the setting of the initial position of the impact header (step 3.5.1). In step 3.3.3, if the temperature of the heat plate is too high, it becomes difficult to form a pattern because the viscosity of the film hinders the creation of a fine pattern. On the other hand, if the temperature of the heat plate is too low, the pattern is not engraved smoothly. The factor of the initial position of the impact header is important because the position of the impact header is related to the depth and width of the pattern. Moreover, if the height of the impact header is too low, the mover of the impact header will collide with the heat plate, causing damage to both the mover and the heat plate. This damage not only wears down the tip of the mover but also has an adverse effect on the height and width of the pattern engraved in the next step. For these reasons, during steps 3.3.3 and 3.5.1, the heating temperature and ignition condition should be carefully considered.
In earlier work on impact-type hot embossing, a dot patterning process was utilized with PMMA film, with deviation errors occurring due to a fixation problem associated with the polymer film15,16. To solve this problem, fixing the polymer film using film holders on both sides of the heat plate was considered, and this strategy reduced the error compared to the earlier values. It was also shown that dot patterns with various widths and depths can be engraved onto various polymer films, such as PET film and PVC films, in real time. Comparing the error rate of PMMA with those of previous hot embossing processes, the results of each film sample showed that the errors in the pattern widths and depths were significantly reduced.
However, there remained some error in the dot patterns. We considered two causes for these errors. The first is related to the change of the surface due to the glass transition temperature of the polymer film. When each film is heated above its glass transition temperature, the surface of the polymer film becomes soft, and the film surface rises slightly even if it remains fixed while using the film holder, causing an error. To prevent this, if the temperature of the heat plate is lower than the glass transfer temperature, the combination of the molecular structure of the polymer film is stronger, but the pattern on the polymer film is not engraved as well. Therefore, it is cumbersome to find the optimum value for each corresponding polymer film through repeated experiments. The second cause is the imbalance problem of the heat plate. The surface of the heat plate that heats the film during the hot embossing process should be entirely horizontal to engrave the height of the dot patterns uniformly. However, if the heat plate is slightly inclined, errors in the pattern width or pattern height will occur when the pattern uses a different position. To solve this problem, we consider that a device that can scan the height of a surface in real time should be attached to the impact header. More research should be done on scanning devices to measure the surface height properly.
The precision of the patterns produced by the suggested process also has limitations. The width and depth of each pattern depend on the diameter of the tip of the mover (impact head) and the depth at which the mover engraves on the polymer film. The diameter of the tip of the mover used in this process is 9 &micro;m, and the precision of the engraved pattern has a minimum pattern width of 9 &micro;m. However, the existing plate-to-plate type and roll-to-roll type hot embossing processes offer pattern precision levels in the nm range. This lack of precision of a pattern can be solved by reducing the diameter of the tip of the mover in the impact header. There is insufficient research thus far on mechanical or chemical processes for processing mover tips into nm units. If studies of mechanical or chemical processes are conducted so that the mover tip can be processed in nm units, it is expected that these limitations will be overcome. Still, unlike the conventional methods, the proposed process allows changes to the engraving pattern in real time using the impact header, and this offers the advantage of changing the new pattern or replacing the pattern if an erroneous process is found.
Next, we compared the processing speed of the proposed process with that of the existing roll-to-roll type hot embossing process. For the conventional roll-to-roll type, the process speed is 10 mm/s12. The proposed impact print-type hot embossing process offers a performance frequency of 6 Hz&ndash;10 Hz. If ten points are assumed on a 10 mm polymer film, the processing speed is 6 mm/sec and the maximum is 10 mm/s. As a result, the processing speed will vary depending on the pattern required by the user. Therefore, the process can be applied to mass production and to various product and small-volume production processes as well.
If we continue to develop our current technology, it will be able to engrave continuous patterns in addition to point patterns. Engraving continuous patterns can be useful in a variety of ways. For example, by placing electrical elements or by applying conductive ink onto the engraved pattern, a microelectrical circuit can be manufactured. Notably, because this process is linked to work on engraving micro- or nanopatterns on polymer films, it can be applied to manufacture flexible devices. Moreover, as our method is like existing hot embossing processes, this work can be used to manufacture flexible copper clad laminates (FCCLs) or flexible printed circuit boards (FPCBs). In addition, in order to apply the impact print-type hot embossing process to a wider range of materials, such as wearable devices or sensors, it is necessary to change the dot pattern by using various widths and depths depending on the device. The impact print-type hot embossing process investigated here has the advantage of being able to engrave various patterns while adjusting the widths and depths of the patterns in real time. Moreover, the technology mentioned in the protocol uses a simpler process than the conventional patterning process. Therefore, we are convinced that impact print-type hot embossing technology can be extended not only to mass production but also to the small-quantity batch production industry in the future.

Researchers are actively attempting to miniaturize existing devices and displays and increase the flexibility of these devices1,2. To reduce the width and depth of electrical channels to the micro or nano scale, high-precision technology is necessary. In addition, to increase the flexibility of these devices, the patterns of the electrical channels must be located on a flexible material, such as a polymer film3,4. To meet these conditions, the study of ultrafine microprocessing technology is actively underway.
Ultrafine microfabrication technology has an advantage in that possible patterning materials include not only highly rigid materials such as iron or plastic but also soft materials such as polymer films. Due to these advantages, this technology is widely used as a core process in various fields, such as communications, chemistry, optics, aerospace, semiconductor, and sensors5,6,7. In the ultrafine microprocessing field, LIGA (lithography, electroplating, and molding) or micromachining methods are used8. However, these conventional methods are associated with several problems. LIGA methods require a considerable amount of time and several process steps to create ultrafine patterns and incur a high cost as well because they need many different types of equipment during the processes. In addition, LIGA methods use chemicals that can pollute the environment.
To address this issue, hot embossing process technology has been spotlighted among ultrafine microprocess technologies. Hot embossing is a technology that creates a pattern on a heated polymer film using a micro- or nanoscale embossing mold. Conventional hot embossing technology is divided into the plate type and roll-to-roll type depending on the shape of the mold. The two types of hot embossing technology are different in terms of the shape of the mold, but these two processes are similar in that the embossing mold presses the polymer film onto a heated plate to engrave a pattern onto the polymer film. To engrave the pattern using the hot embossing process, it is necessary to heat the polymer film above the glass transition temperature and to apply an adequate amount of pressure (~30&#8211;50 MPa)9. In addition, the width and depth of the pattern change depending on the temperature of the heated plate, the material, and the shape of the embossing mold. Moreover, the cooling method after the patterning process affects the shape of the pattern on the polymer film.
In the conventional hot embossing process, embossing stamps or rollers can be embossed with the desired pattern, and the embossing mold can be used to print the same pattern onto polymer film surfaces continuously. This feature makes this process suitable not only for mass production but also for fabricating devices with soft materials, such as polymer films10,11,12,13,14. However, the conventional hot embossing method can only create the single pattern engraved in the embossing mold. Therefore, when the user wants to make a new pattern or modify the pattern, they must make a new mold to modify the imprinting pattern. For this reason, conventional hot embossing is costly and time-consuming when creating new patterns or replacing existing designs.
Earlier work introduced the impact-type hot embossing process for producing dot patterns with various widths and depths in real time15. Unlike the conventional hot embossing process, the impact print-type hot embossing method uses an impact header to create patterns on the polymer film. This technology moves the impact header to the desired position with a precision positioning system. A control signal is applied to print patterns at a desired width and depth and at an arbitrary position. The structure of the impact header consists of a mover, a spring, a coil winding, and a core (see Figure 1A)15. Earlier work confirmed through an analysis and experiment that such an impact header can produce the proper force for hot embossing16. The protocol of this paper covers the design of the hardware for the impact-type hot embossing process and the control environment for process control. In addition, we analyze the dot patterns on PET film, PMMA film, and PVC film, all of which are processed with the proposed protocol to verify that the impact print-type hot embossing process can create dot patterns with various widths and depths in real time. The results of these experiments are presented below in the results section, confirming that the embossing process can suitably produce ultrafine patterns.

<table><tbody><tr><td>0.3mm High Quality Clear Rigid Packaging PVC Film Roll For Vacuum Forming</td><td>Sunyo</td><td>SY1023</td><td>PVC film / Thickness : 300&amp;micro;m</td></tr><tr><td>Acryl(PMMA) film</td><td>SEJIN TS</td><td>C200</td><td>PMMA film / Thickness : 175&amp;micro;m</td></tr><tr><td>Confocal Laser Scanning Microscope: 3D-Topography for Materials Analysis and Testing</td><td>Carl Zeiss</td><td>LSM 700</td><td>3D confocal microscope / Supporting Mode : 2D, 2.5D, 3D topography</td></tr><tr><td>DAQ board</td><td>NATIONAL INSTRUMENTS</td><td>USB-6211</td><td>Control board for two stage and impact header / 16 inputs, 16-bit, 250kS/s, Multifunction I/O</td></tr><tr><td>DC Power Supply</td><td>SMART</td><td>RDP-305AU</td><td>3 channel power supply / output voltage : 0~30V, Output current : 0~5A</td></tr><tr><td>L511 stage</td><td>PI</td><td>L511.20SD00</td><td>Z-stage / Travel range : 52mm</td></tr><tr><td>Large Digital Hotplate</td><td>DAIHAN Scientific</td><td>HPLP-C-P</td><td>Heatplate / Max Temp : 350&amp;ordm;C</td></tr><tr><td>M531 stage</td><td>PI</td><td>M531.2S1</td><td>X-stage / Travel range : 306mm</td></tr><tr><td>Mylar Polyester PET films</td><td>CSHyde</td><td>48-2F-36</td><td>PET film / Thickness : 50&amp;micro;m</td></tr><tr><td>OPA2541</td><td>BURR-BROWN</td><td>OPA2541BM</td><td>OP-AMP / Output currents : 5A, output voltage : &amp;plusmn;40V</td></tr></tbody></table>

study of a dot-patterning process on flexible materials using impact print-type hot embossing technology

Here we present our study on an impact print-type hot embossing process which can create dot patterns with various designs, widths, and depths in real time on polymer film. In addition, we implemented a control system for the on-off motion and position of the impact header to engrave different dot patterns. We performed dot patterning on various polymer films, such as polyester (PET) film, polymethyl methacrylate (PMMA) film, and polyvinyl chloride (PVC) film. The dot patterns were measured using a confocal microscope, and we confirmed that the impact print-type hot embossing process produces fewer errors during the dot patterning process. As a result, the impact print-type hot embossing process is found to be suitable for engraving dot patterns on different types of polymer films. In addition, unlike the conventional hot embossing process, this process does not use an embossing stamp. Therefore, the process is simple and can create dot patterns in real time, presenting unique advantages for mass production and small-quantity batch production.

The impact print-type hot embossing process is a process that can be used to engrave dot patterns onto a polymer film in real time, as shown in Figure 1. This process can resolve the issues of the high cost and long times for pattern replacement associated with the existing hot embossing process. A control circuit was constructed, as shown in Figure 2 (see steps 2.3&#8211;2.3.9), using the DAQ, OP-AMP, and power supply to carve patterns on various types of polymer films by the implementation of the impact header during the on-off operation. The implemented impact print-type hot embossing process is shown in Figure 3.
In previous studies of impact print-type hot embossing, only experiments on PMMA films were validated, while no other polymer films were tested. In order to verify that impact print-type hot embossing can engrave patterns on other polymer films in real time, experiments were carried out using PMMA film, PVC film, and PET film. The height of the impact header was reduced by 10 &#956;m for every three points using a Z-stage, and we tested whether nine dots could form a dot pattern with various heights on the three types of films. Using the equipment shown in Figure 3, a dot pattern was created on the three polymer films, and a confocal microscope was used to observe the pattern (see step 3.6).
The dot pattern is shown in Figure 4B. As shown in Figure 4B, nine points were utilized, and the size of the pattern increased from Sample 1 (S1) to Sample 3 (S3) because the height of the Z-stage moved down by 10 &#956;m. In this case, two-dimensional (2D) images by the confocal microscope of the three polymer films are shown in Figure 5. The 2D image in Figure 5 shows the S1 portion of each pattern. Figure 5A shows a PET film sample 50 &#956;m thick, Figure 5B shows a PMMA film sample 175 &#956;m thick, and Figure 5C shows a PVC film sample 300 &#956;m thick. Figure 6 shows 2D micrographs of one dot pattern and 3D micrographs of S1 using the laser scanning mode (LSM) of the confocal microscope. As shown in Figure 6, we could measure the pattern width and depth of each dot pattern, and the pattern was clearly observable through the 2D image of one dot.
The width and depth results of the nine dot patterns on the three polymer films using the 3D function of the confocal microscope are shown in Table 1. The PET film is thinner than the other polymer films. Therefore, we created the sample carefully so that the impact header did not touch the heat plate when the Z-stage was adjusted. For PET, in S1 the average values of the pattern width and depth were 110.6 &#956;m and 10.3 &#956;m respectively, with corresponding errors of ~-5.6&#8211;6.2% and ~-3.3&#8211;1.7%. For S2, after the height of the Z-stage was decreased by 10 &#956;m, the average values for the pattern width and depth changed to 155.2 &#956;m and 17.0 &#956;m respectively, with corresponding errors of ~-5.2&#8211;2.8% and ~-3.0&#8211;2.0%. For S3, after the height of the Z-stage was decreased by another 10 &#956;m, the average values for the pattern width and depth changed to 170.8 &#956;m and 25.7 &#956;m respectively, with corresponding errors of ~-2.8&#8211;4.2% and ~-2.7&#8211;2.3%.
For PMMA, in S1 the average values of the pattern width and depth were 240.2 &#956;m and 112.2 &#956;m respectively, with corresponding errors of ~-1.2&#8211;1.3% and ~-4.1&#8211;2.8%. For S2, after the height of the Z-stage was decreased by 10 &#956;m, the average values for the pattern width and depth changed to 250.0 &#956;m and 129.8 &#956;m respectively, with corresponding errors of ~-2.0&#8211;2.0% and ~-1.8&#8211;1.1%. For S3, after the height of the Z-stage was decreased by another 10 &#956;m, the average values for the pattern width and depth changed to 281.2 &#956;m and 141.3 &#956;m, with corresponding errors of ~-3.1&#8211;3.8% and ~-3.3&#8211;2.6%.
For PVC, in S1 the average values of the pattern width and depth were 236.4 &#956;m and 136.1 &#956;m respectively, with corresponding errors of ~-6.3&#8211;4.0% and -~5.6&#8211;3.9%. For S2, after the height of the Z-stage was decreased by 10 &#956;m, the average values of the pattern width and depth changed to 250.8 &#956;m and 150.7 &#956;m respectively, with corresponding errors of ~-2.5&#8211;2.4% and ~-2.1&#8211;2.8%. For S3, after the height of the Z-stage was decreased by another 10 &#956;m, the average values of the pattern width and depth changed to 263.5 &#956;m and 159.2 &#956;m, with corresponding errors of ~-6.7&#8211;11.7% and ~-5.0&#8211;7.5%.
Graphs of the pattern depth and width for the three polymer films are shown in Figure 7. The height of the Z-stage was decreased by 10 &#956;m for every three dot patterns from S1 to S3, so that the width and depth of the film increased from S1 to S3. The maximum error was in the range of -6.7&#8211;11.7% for PVC and the minimum error ranged from -1.2&#8211;1.3% for PMMA. In conclusion, the errors in the dot patterns for the three types of films are minor. This shows that the impact print-type hot embossing process is suitable for engraving micropatterns onto polymer films in real time.
<img alt="Figure 1" class="xfigimg" src="/files/ftp_upload/60694/60694fig1a.jpg" /> 
Figure 1: Design of the impact print-type hot embossing technology. (A) A 3D design of the impact print-type hot embossing process, (B) design of the film holder. The film holder can move in the Motion 1 and Motion 2 directions and can be used to fix the film or to move it to the side. <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/60694fig1alarge.jpg" target="_blank">Please click here to view a larger version of this figure.</a>
<img alt="Figure 2" class="xfigimg" src="/files/ftp_upload/60694/60694fig2a.jpg" /> 
Figure 2: Schematic design of the electricity amplifier circuit. In this picture, six devices are used to create the circuit: a power supply with two channels, a high-power operational amplifier (OP-AMP), a control device, an impact header, and two resistance components with different values. Each device is connected in the image, and the connection lines are shown in various colors. <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/60694fig2alarge.jpg" target="_blank">Please click here to view a larger version of this figure.</a>
<img alt="Figure 3" class="xfigimg" src="/files/ftp_upload/60694/60694fig3a.jpg" /> 
Figure 3: Implementation of the impact print-type hot embossing process and control circuit. (A) Implementation of the impact print-type hot embossing process, and (B) experimental settings of the control system <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/60694fig3alarge.jpg" target="_blank">Please click here to view a larger version of this figure.</a>
<img alt="Figure 4" class="xfigimg" src="/files/ftp_upload/60694/60694fig4a.jpg" /> 
Figure 4: Confocal microscope equipment and PET film with dot patterns. (A) Confocal microscope equipment to measure the pattern widths and depths of the dot patterns on the polymer film. (B) Dot patterns on the PET film. The nine patterns are divided into three sections from the lowest depth of the dot patterns (S1, S2, S3), and each section has three points. Micrographs are taken using the 2D function of the confocal microscope. <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/60694fig4alarge.jpg" target="_blank">Please click here to view a larger version of this figure.</a>
<img alt="Figure 5" class="xfigimg" src="/files/ftp_upload/60694/60694fig5a.jpg" /> 
Figure 5: Two-dimensional photomicrographs using confocal microscope. (A) A 2D photomicrograph of the 50 &#956;m PET film, (B) 2D photomicrograph of the 175 PMMA film, and (C) 2D photomicrograph of the 300 PVC film <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/60694fig5alarge.jpg" target="_blank">Please click here to view a larger version of this figure.</a>
<img alt="Figure 6" class="xfigimg" src="/files/ftp_upload/60694/60694fig6a.jpg" /> 
Figure 6: Two-dimensional micrographs of one dot pattern and 3D micrographs of S1 using the LSM mode of the confocal microscope. (A) A 3D micrograph of three dot patterns and a 2D micrograph of one dot pattern on the 50-&#956;m-thick PET film. (B) A 3D micrograph of three dot patterns and a 2D micrograph of one dot pattern on the 175-&#956;m-thick PMMA film. (C) A 3D micrograph of three dot patterns and a 2D micrograph of one dot pattern on the 300-&#956;m-thick PVC film <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/60694fig6alarge.jpg" target="_blank">Please click here to view a larger version of this figure.</a>
<img alt="Figure 7" class="xfigimg" src="/files/ftp_upload/60694/60694fig7a.jpg" /> 
Figure 7: Graphs of the pattern widths and depths for S1, S2, and S3 on three polymer films. The position of the Z-stage was increased by 10 &#181;m for every three dot patterns from S1 to S3, and each graph is based on the data shown in Table 1.&#160;(A) The result of the pattern width and pattern depth for the PET film. (B) The result of the pattern width and pattern depth for the PMMA film. (C) The results of the pattern width and pattern depth for the PVC film. <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/60694fig7alarge.jpg" target="_blank">Please click here to view a larger version of this figure.</a>
<table border="1" fo:keep-together.within-page="1" fo:keep-with-next.within-page="always">
	<tbody>
		<tr>
			<td>Polymer Film</td>
			<td>Sample Number</td>
			<td>Average of Pattern Width (&#956;m)</td>
			<td>Average of Pattern Depth (&#956;m)</td>
			<td>Error rate Width (%)</td>
			<td>Error rate Depth (%)</td>
		</tr>
		<tr>
			<td>PVC Film</td>
			<td>S1</td>
			<td>236.4</td>
			<td>136.1</td>
			<td>-6.3~4.0%</td>
			<td>-5.6~3.9%</td>
		</tr>
		<tr>
			<td></td>
			<td>S2</td>
			<td>250.8</td>
			<td>150.7</td>
			<td>-2.5%~2.4%</td>
			<td>-2.1~2.8%</td>
		</tr>
		<tr>
			<td></td>
			<td>S3</td>
			<td>263.5</td>
			<td>159.2</td>
			<td>-6.7%~11.7%</td>
			<td>-5.0~7.5%</td>
		</tr>
		<tr>
			<td>PMMA Film</td>
			<td>S1</td>
			<td>240.2</td>
			<td>112.2</td>
			<td>-1.2~1.3%</td>
			<td>-4.1~2.8%</td>
		</tr>
		<tr>
			<td></td>
			<td>S2</td>
			<td>250</td>
			<td>129.8</td>
			<td>-2.0~2.0%</td>
			<td>-1.8~1.1%</td>
		</tr>
		<tr>
			<td></td>
			<td>S3</td>
			<td>281.2</td>
			<td>141.3</td>
			<td>-3.1~3.8%</td>
			<td>-3.3~2.6%</td>
		</tr>
		<tr>
			<td>PET Film</td>
			<td>S1</td>
			<td>110.6</td>
			<td>10.3</td>
			<td>-5.6~6.2%</td>
			<td>-3.3~1.7%</td>
		</tr>
		<tr>
			<td></td>
			<td>S2</td>
			<td>155.2</td>
			<td>17</td>
			<td>-5.2~2.8%</td>
			<td>-3.0~2.0%</td>
		</tr>
		<tr>
			<td></td>
			<td>S3</td>
			<td>170.8</td>
			<td>25.7</td>
			<td>-2.8~4.2%</td>
			<td>-2.7~2.3%</td>
		</tr>
	</tbody>
</table>
Table 1: Measurement results of nine dot patterns on three polymer films. The values in the table were measured using the 3D measurement function of the confocal microscope and represent the average values of the pattern widths and depths and the pattern errors for S1, S2, and S3.
Supplementary File 1. <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/Supplementary_files1.stl" target="_blank">Please click here to download this file.</a>
Supplementary File 2. <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/60694/Supplementary_files2.stl" target="_blank">Please click here to download this file.</a>

Watch this Scientific Journal Video about Study of a Dot-patterning Process on Flexible Materials using Impact Print-Type Hot Embossing Technology at JoVE.com

Study of a Dot-patterning Process on Flexible Materials using Impact Print-Type Hot Embossing Technology

Impact print-type hot embossing technology uses an impact header to engrave dot patterns on flexible materials in real time. This technology has a control system for controlling the on-off motion and position of the impact header to create dot patterns with various widths and depths on different polymer films.

Here we present our study on an impact print-type hot embossing process which can create dot patterns with various designs, widths, and depths in real ...

study-dot-patterning-process-on-flexible-materials-using-impact-print

Nanyang Technological University

Research

JoVE Journal

Engineering

5.9K Views.  Daegu Gyeongbuk Institute of Science and Technology (DGIST). Impact Print-Type Hot Embossed technologie kan dot patronen die patroon breedte en diepte kan veranderen in real time, op verschillende soorten polymeer films, met behulp van een impact patroon. In vergelijking met de bestaande hot embossing technologie, de kosten van de geperste patroon vorm is aanzienlijk lager en willekeurige reliëf vorm kan worden gemaakt in real time. Onze technologie kan worden toegepast op de bio-apparaten veld en deze apparaten kunnen helpen om de patiënt conditie o...

Video: Study of a Dot-patterning Process on Flexible Materials using Impact Print-Type Hot Embossing Technology

Micropunching Lithography for Generating Micro- and Submicron-patterns on Polymer Substrates

Conducting polymers have attracted great attention since the discovery of high conductivity in doped polyacetylene in 19771. They offer the advantages of low weight, easy tailoring of properties and a wide spectrum of applications2,3. Due to sensitivity of conducting polymers to environmental conditions (e.g., air, oxygen, moisture, high temperature and chemical solutions), lithographic techniques present significant technical challenges when working with these materials4. For example, current photolithographic methods, such as ultra-violet (UV), are unsuitable for patterning the conducting polymers due to the involvement of wet and/or dry etching processes in these methods. In addition, current micro/nanosystems mainly have a planar form5,6. One layer of structures is built on the top surfaces of another layer of fabricated features. Multiple layers of these structures are stacked together to form numerous devices on a common substrate. The sidewall surfaces of the microstructures have not been used in constructing devices. On the other hand, sidewall patterns could be used, for example, to build 3-D circuits, modify fluidic channels and direct horizontal growth of nanowires and nanotubes.
A macropunching method has been applied in the manufacturing industry to create macropatterns in a sheet metal for over a hundred years. Motivated by this approach, we have developed a micropunching lithography method (MPL) to overcome the obstacles of patterning conducting polymers and generating sidewall patterns. Like the macropunching method, the MPL also includes two operations (Fig. 1): (i) cutting; and (ii) drawing. The "cutting" operation was applied to pattern three conducting polymers4, polypyrrole (PPy), Poly(3,4-ethylenedioxythiophen)-poly(4-styrenesulphonate) (PEDOT) and polyaniline (PANI). It was also employed to create Al microstructures7. The fabricated microstructures of conducting polymers have been used as humidity8, chemical8, and glucose sensors9. Combined microstructures of Al and conducting polymers have been employed to fabricate capacitors and various heterojunctions9,10,11. The "cutting" operation was also applied to generate submicron-patterns, such as 100- and 500-nm-wide PPy lines as well as 100-nm-wide Au wires. The "drawing" operation was employed for two applications: (i) produce Au sidewall patterns on high density polyethylene (HDPE) channels which could be used for building 3D microsystems12,13,14, and (ii) fabricate polydimethylsiloxane (PDMS) micropillars on HDPE substrates to increase the contact angle of the channel15.

A micropunching lithography approach is developed to generate micro- and submicron-patterns on top, sidewall and bottom surfaces of polymer substrates. It overcomes the obstacles of patterning conducting polymers and generating sidewall patterns. This method allows rapid fabrication of multiple features and is free of aggressive chemistry.

Conducting polymers have attracted great attention since the discovery of high conductivity in doped polyacetylene in 19771. They offer the advantages of ...

Creating Two-Dimensional Patterned Substrates for Protein and Cell Confinement

Microcontact printing provides a rapid, highly reproducible method for the creation of well-defined patterned substrates.1 While microcontact printing can be employed to directly print a large number of molecules, including proteins,2 DNA,3 and silanes,4 the formation of self-assembled monolayers (SAMs) from long chain alkane thiols on gold provides a simple way to confine proteins and cells to specific patterns containing adhesive and resistant regions. This confinement can be used to control cell morphology and is useful for examining a variety of questions in protein and cell biology. Here, we describe a general method for the creation of well-defined protein patterns for cellular studies.5 This process involves three steps: the production of a patterned master using photolithography, the creation of a PDMS stamp, and microcontact printing of a gold-coated substrate. Once patterned, these cell culture substrates are capable of confining proteins and/or cells (primary cells or cell lines) to the pattern.
The use of self-assembled monolayer chemistry allows for precise control over the patterned protein/cell adhesive regions and non-adhesive regions; this cannot be achieved using direct protein stamping. Hexadecanethiol, the long chain alkane thiol used in the microcontact printing step, produces a hydrophobic surface that readily adsorbs protein from solution. The glycol-terminated thiol, used for backfilling the non-printed regions of the substrate, creates a monolayer that is resistant to protein adsorption and therefore cell growth.6 These thiol monomers produce highly structured monolayers that precisely define regions of the substrate that can support protein adsorption and cell growth. As a result, these substrates are useful for a wide variety of applications from the study of intercellular behavior7 to the creation of microelectronics.8
While other types of monolayer chemistry have been used for cell culture studies, including work from our group using trichlorosilanes to create patterns directly on glass substrates,9 patterned monolayers formed from alkane thiols on gold are straight-forward to prepare. Moreover, the monomers used for monolayer preparation are commercially available, stable, and do not require storage or handling under inert atmosphere. Patterned substrates prepared from alkane thiols can also be recycled and reused several times, maintaining cell confinement.10

Self-assembled monolayers (SAMs) formed from long chain alkane thiols on gold provide well-defined substrates for the formation of protein patterns and cell confinement. Microcontact printing of hexadecanethiol using a polydimethylsiloxane (PDMS) stamp followed by backfilling with a glycol-terminated alkane thiol monomer produces a pattern where protein and cells adsorb only to the stamped hexadecanethiol region.

Microcontact printing provides a rapid, highly reproducible method for the creation of well-defined patterned substrates.1  While microcontact printing ...

Bioengineering

Soft Lithographic Functionalization and Patterning Oxide-free Silicon and Germanium

The development of hybrid electronic devices relies in large part on the integration of (bio)organic materials and inorganic semiconductors through a stable interface that permits efficient electron transport and protects underlying substrates from oxidative degradation. Group IV semiconductors can be effectively protected with highly-ordered self-assembled monolayers (SAMs) composed of simple alkyl chains that act as impervious barriers to both organic and aqueous solutions. Simple alkyl SAMs, however, are inert and not amenable to traditional patterning techniques. The motivation for immobilizing organic molecular systems on semiconductors is to impart new functionality to the surface that can provide optical, electronic, and mechanical function, as well as chemical and biological activity. 
Microcontact printing (&mu;CP) is a soft-lithographic technique for patterning SAMs on myriad surfaces.1-9 Despite its simplicity and versatility, the approach has been largely limited to noble metal surfaces and has not been well developed for pattern transfer to technologically important substrates such as oxide-free silicon and germanium. Furthermore, because this technique relies on the ink diffusion to transfer pattern from the elastomer to substrate, the resolution of such traditional printing is essentially limited to near 1 &mu;m.10-16
In contrast to traditional printing, inkless &mu;CP patterning relies on a specific reaction between a surface-immobilized substrate and a stamp-bound catalyst. Because the technique does not rely on diffusive SAM formation, it significantly expands the diversity of patternable surfaces. In addition, the inkless technique obviates the feature size limitations imposed by molecular diffusion, facilitating replication of very small (&lt;200 nm) features.17-23 However, up till now, inkless &mu;CP has been mainly used for patterning relatively disordered molecular systems, which do not protect underlying surfaces from degradation.
Here, we report a simple, reliable high-throughput method for patterning passivated silicon and germanium with reactive organic monolayers and demonstrate selective functionalization of the patterned substrates with both small molecules and proteins. The technique utilizes a preformed NHS-reactive bilayered system on oxide-free silicon and germanium. The NHS moiety is hydrolyzed in a pattern-specific manner with a sulfonic acid-modified acrylate stamp to produce chemically distinct patterns of NHS-activated and free carboxylic acids. A significant limitation to the resolution of many &mu;CP techniques is the use of PDMS material which lacks the mechanical rigidity necessary for high fidelity transfer. To alleviate this limitation we utilized a polyurethane acrylate polymer, a relatively rigid material that can be easily functionalized with different organic moieties. Our patterning approach completely protects both silicon and germanium from chemical oxidation, provides precise control over the shape and size of the patterned features, and gives ready access to chemically discriminated patterns that can be further functionalized with both organic and biological molecules. The approach is general and applicable to other technologically-relevant surfaces.

Here we describe a simple method for patterning oxide-free silicon and germanium with reactive organic monolayers and demonstrate functionalization of the patterned substrates with small molecules and proteins. The approach completely protects surfaces from chemical oxidation, provides precise control over feature morphology, and provides ready access to chemically discriminated patterns.

The development of hybrid electronic devices relies in large part on the integration of (bio)organic materials and inorganic semiconductors through a ...

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly known as plasmonic effects, play an important role. Research in this field has, however, been impeded owing to the difficulty of fabricating devices containing the desired functional metal nanostructures. In order to provide a viable strategy to this issue, we herein show a transfer printing-based approach that allows the quick and low-cost integration of designed metal nanostructures with a variety of device architectures, including solar cells. Nanopillar poly(dimethylsiloxane) (PDMS) stamps were fabricated from a commercially available nanohole plastic film as a master mold. On this nanopatterned PDMS stamps, Ag films were deposited, which were then transfer-printed onto block copolymer (binding layer)-coated hydrogenated microcrystalline Si (&#181;c-Si:H) surface to afford ordered Ag nanodisk structures. It was confirmed that the resulting Ag nanodisk-incorporated &#181;c-Si:H solar cells show higher performances compared to a cell without the transfer-printed Ag nanodisks, thanks to plasmonic light trapping effect derived from the Ag nanodisks. Because of the simplicity and versatility, further device application would also be feasible thorough this approach.

A viable transfer printing-based methodology to introduce plasmonic metal nanostructures in solar cells is described. Using nanopillar poly(dimethylsiloxane) stamps, an Ag-based ordered nanodisk array was integrated with standard hydrogenated microcrystalline Si solar cells, which led to improved device performances due to plasmonic light trapping.

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly ...

Creating Adhesive and Soluble Gradients for Imaging Cell Migration with Fluorescence Microscopy

Cells can sense and migrate towards higher concentrations of adhesive cues such as the glycoproteins of the extracellular matrix and soluble cues such as growth factors. Here, we outline a method to create opposing gradients of adhesive and soluble cues in a microfluidic chamber, which is compatible with live cell imaging. A copolymer of poly-L-lysine and polyethylene glycol (PLL-PEG) is employed to passivate glass coverslips and prevent non-specific adsorption of biomolecules and cells. Next, microcontact printing or dip pen lithography are used to create tracks of streptavidin on the passivated surfaces to serve as anchoring points for the biotinylated peptide arginine-glycine-aspartic acid (RGD) as the adhesive cue. A microfluidic device is placed onto the modified surface and used to create the gradient of adhesive cues (100% RGD to 0% RGD) on the streptavidin tracks. Finally, the same microfluidic device is used to create a gradient of a chemoattractant such as fetal bovine serum (FBS), as the soluble cue in the opposite direction of the gradient of adhesive cues.

A method for the assembly of adhesive and soluble gradients in a microscopy chamber for live cell migration studies is described. The engineered environment combines antifouling surfaces and adhesive tracks with solution gradients and therefore allows one to determine the relative importance of guidance cues.

Cells can sense and migrate towards higher concentrations of adhesive cues such as the glycoproteins of the extracellular matrix and soluble cues such as ...

Fabricating Reactive Surfaces with Brush-like and Crosslinked Films of Azlactone-Functionalized Block Co-Polymers

In this paper, fabrication methods that generate novel surfaces using the azlactone-based block co-polymer, poly (glycidyl methacrylate)-block-poly (vinyl dimethyl azlactone) (PGMA-b-PVDMA), are presented. Due to the high reactivity of azlactone groups towards amine, thiol, and hydroxyl groups, PGMA-b-PVDMA surfaces can be modified with secondary molecules to create chemically or biologically functionalized interfaces for a variety of applications. Previous reports of patterned PGMA-b-PVDMA interfaces have used traditional top-down patterning techniques that generate non-uniform films and poorly controlled background chemistries. Here, we describe customized patterning techniques that enable precise deposition of highly uniform PGMA-b-PVDMA films in backgrounds that are chemically inert or that have biomolecule-repellent properties. Importantly, these methods are designed to deposit PGMA-b-PVDMA films in a manner that completely preserves azlactone functionality through each processing step. Patterned films show well-controlled thicknesses that correspond to polymer brushes (~90 nm) or to highly crosslinked structures (~1-10 &#956;m). Brush patterns are generated using either the parylene lift-off or interface directed assembly methods described and are useful for precise modulation of overall chemical surface reactivity by adjusting either the PGMA-b-PVDMA pattern density or the length of the VDMA block. In contrast, the thick, crosslinked PGMA-b-PVDMA patterns are obtained using a customized micro-contact printing technique and offer the benefit of higher loading or capture of secondary material due to higher surface area to volume ratios. Detailed experimental steps, critical film characterizations, and trouble-shooting guides for each fabrication method are discussed.

Surface fabrication methods for patterned deposition of nanometer thick brushes or micron thick, crosslinked films of an azlactone block co-polymer are reported. Critical experimental steps, representative results, and limitations of each method are discussed. These methods are useful for creating functional interfaces with tailored physical features and tunable surface reactivity.

In this paper, fabrication methods that generate novel surfaces using the azlactone-based block co-polymer, poly (glycidyl methacrylate)-block-poly (vinyl ...

Scalable Stamp Printing and Fabrication of Hemiwicking Surfaces

Hemiwicking is a process where a fluid wets a patterned surface beyond its normal wetting length due to a combination of capillary action and imbibition. This wetting phenomenon is important in many technical fields ranging from physiology to aerospace engineering. Currently, several different techniques exist for fabricating hemiwicking structures. These conventional methods, however, are often time consuming and are difficult to scale-up for large areas or are difficult to customize for specific, nonhomogeneous patterning geometries. The presented protocol provides researchers with a simple, scalable, and cost-effective method for fabricating micro-patterned hemiwicking surfaces. The method fabricates wicking structures through the use of stamp printing, polydimethylsiloxane (PDMS) molding, and thin-film surface coatings. The protocol is demonstrated for hemiwicking with ethanol on PDMS micropillar arrays coated with a 70 nm thick aluminum thin-film.

A simple protocol is provided for the fabrication of hemiwicking structures of varying sizes, shapes, and materials. The protocol uses a combination of physical stamping, PDMS molding, and thin-film surface modifications via common materials deposition techniques.

Hemiwicking is a process where a fluid wets a patterned surface beyond its normal wetting length due to a combination of capillary action and imbibition. ...

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

Today, wearable electronics devices combine a large variety of functional, stretchable, and flexible technologies. However, in many cases, these devices cannot be worn under everyday conditions. Therefore, textiles are commonly considered the best substrate to accommodate electronic devices in wearable use. In this paper, we describe how to selectively pattern organic electroactive materials on textiles from a solution in an easy and scalable manner. This versatile deposition technique enables the fabrication of wearable organic electronic devices on clothes.

In this paper, we present a protocol to selectively deposit organic materials on textiles, which allows for the direct integration of organic electronic devices with wearables. The fabricated devices can be fully integrated in textiles, respecting their mechanical appearance and enabling sensing capabilities.

Today, wearable electronics devices combine a large variety of functional, stretchable, and flexible technologies. However, in many cases, these devices ...

Micro-Embossed Fabrication of Nanocellulose Paper-Based Analytical Devices  

Microembossing: A Convenient Process for Fabricating Microchannels on Nanocellulose Paper-Based Microfluidics

Nanopaper, derived from nanofibrillated cellulose, has generated considerable interest as a promising material for microfluidic applications. Its appeal lies in a range of excellent&#160;qualities, including an exceptionally smooth surface, outstanding optical transparency, a uniform nanofiber matrix with nanoscale porosity, and customizable chemical properties. Despite the rapid growth of nanopaper-based microfluidics, the current techniques used to create microchannels on nanopaper, such as 3D printing, spray coating, or manual cutting and assembly, which are crucial for practical applications, still possess certain limitations, notably susceptibility to contamination. Furthermore, these methods are restricted to the production of millimeter-sized channels. This study introduces a straightforward process that utilizes convenient plastic micro-molds for simple microembossing operations to fabricate microchannels on nanopaper, achieving a minimum width of 200 &#181;m. The developed microchannel outperforms existing approaches, achieving a fourfold improvement, and can be fabricated within 45 min. Furthermore, fabrication parameters have been optimized, and a convenient quick-reference table is provided for application developers. The proof-of-concept for a laminar mixer, droplet generator, and functional nanopaper-based analytical devices (NanoPADs) designed for Rhodamine B sensing using surface-enhanced Raman spectroscopy was demonstrated. Notably, the NanoPADs exhibited exceptional performance with improved limits of detection. These outstanding results can be attributed to the superior optical properties of nanopaper and the recently developed accurate microembossing method, enabling the integration and fine-tuning of the NanoPADs.

Author Spotlight: Revolutionizing Microfluidics Through Microchannel Fabrication on Nanopaper 

This protocol describes a straightforward process that utilizes convenient plastic micro-molds for simple microembossing operations to fabricate microchannels on nanofibrillated cellulose paper, achieving a minimum width of 200 &#181;m.

Nanopaper, derived from nanofibrillated cellulose, has generated considerable interest as a promising material for microfluidic applications. Its appeal ...

High-resolution Patterning Using Two Modes of Electrohydrodynamic Jet: Drop on Demand and Near-field Electrospinning

Electrohydrodynamic (EHD) jet printing has drawn attention in various fields because it can be used as a high-resolution and low-cost direct patterning tool. EHD printing uses a fluidic supplier to maintain the extruded meniscus by pushing the ink out of the nozzle tip. The electric field is then used to pull the meniscus down to the substrate to produce high-resolution patterns. Two modes of EHD printing have been used for fine patterning: continuous near-field electrospinning (NFES) and dot-based drop-on-demand (DOD) EHD printing. According to the printing modes, the requirements for the printing equipment and ink viscosity will differ. Even though two different modes can be implemented with a single EHD printer, the realization methods significantly differ in terms of ink, fluidic system, and driving voltage. Consequently, without a proper understanding of the jetting requirements and limitations, it is difficult to obtain the desired results. The purpose of this paper is to present a guideline so that inexperienced researchers can reduce the trial and error efforts to use the EHD jet for their specific research and development purposes. To demonstrate the fine-patterning implementation, we use Ag nanoparticle ink for the conductive patterning in the protocol. In addition, we also present the generalized printing guidelines that can be used for other types of ink for various fine-patterning applications.

Here, we present a protocol to produce high-resolution conductive patterns using electrohydrodynamic (EHD) jet printing. The protocol includes two modes of EHD jet printing: the continuous near-field electrospinning (NFES) and the dot-based drop-on-demand (DOD) EHD printing.

Electrohydrodynamic (EHD) jet printing has drawn attention in various fields because it can be used as a high-resolution and low-cost direct patterning ...

Study of a Dot-patterning Process on Flexible Materials using Impact Print-Type Hot Embossing Technology

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