这项工作是由DARPA从（N66001-08-C-2040）合同，由得克萨斯州的新兴科技基金资助项目。作者要感谢智英金，格雷格Mordi，安吉拉Azcatl，汤姆沙尔夫对有关选择性原子层沉积的贡献，以及马丁·华莱士和戈登·波洛克易地来样加工。

1. 前原位样品制备<ol><li>芯片的准备<ol><li>设计适当的蚀刻掩模将确定在硅（100）晶圆标记。使用标准的光刻和RIE，蚀刻线作为基准标记成从该STM样品将要采取的晶片的一个网格。该线应为10微米宽，1微米深，并在500微米的间距。蚀刻后，剥去样本剩余的光刻胶。 注意:基准标记必须是可识别的原位上的样品，以及在AFM及SEM计量期间尖端位置。 </li><li>通过采用标准的粘性蓝色切割带，胶粘面朝下保护晶圆表面。 </li><li>骰子晶片成使用金刚石片放倒陶瓷切割锯成适合特定UHV-STM工具尺寸正用于执行高密度脂蛋白。这里，将样品分别为8.1毫米×8.1毫米正方形。 </li></ol></li><li>切割后，准备芯片插入UHV-STM图案化模具轻轻剥开切割带，注意不要接触芯片与任何含镍的工具，这将导致特高压准备下文第2节之后的不利表面重建。 <ol><li>清洁芯片通过漂洗正面每10秒用丙酮，异丙醇，甲醇和去离子水分别流，而夹持样品的侧面与聚四氟乙烯（PTFE）镊子。最后，用干超纯N 2或Ar，仍与聚四氟乙烯镊子夹取。 </li><li>用于高密度脂蛋白使用适合于特定UHV-STM工具的方法中的STM样品架安装样品块。 <ol><li>如果安装在一个含镍的样品架，切割用钛剪刀钽箔阻隔带（APPX 4毫米乘试样高度）。声处理箔片，每次5分钟，在超纯丙酮，异丙醇，甲醇和去离子水，分别通过部分地覆盖有铝箔和注入烧杯干燥用超纯N 2气荷兰国际集团的N 2喷嘴进入的开口。气体流量，直到所有的液体蒸发。使用镍游离镊子，形式箔围绕结束样品然后夹紧在样品架以分离样品的正面和背面，从样品架。 </li></ol></li><li>安装，等离子体清洗和样品架在氧等离子体去除碳污染后。28 </li></ol></li></ol> 2.特高压样品制备<ol><li>通过负载锁或另一优选UHV-安全的方法引入样品放入超高真空系统，使特高压处理和HDL通常可保持在低于1.3×10 -9毫巴（除了下面步骤2.5.1.1）。 </li><li>德加O / N在650℃，监测温度与高温计。确保该室压力是内的背景的25％。在这里所描述的情况下，典型的背景压力是约4.5×10 -10毫巴。 </li><li>德加钨氢裂化灯丝在1,500℃下进行5分钟。如果可能的话激活钛升华泵。 </li><li>执行样本"闪光"的怪圈。 <ol><li>通过加热到1250℃持续20秒，监测T搭配高温计和使用10℃/秒的加热梯度闪样品。不要超过7×10 -9毫巴的最大压力。凉爽通过去除加热电流在小于5秒。 </li><li>在350℃下进行5分钟休息样品。以允许压力恢复到基线。重复3倍。 </li></ol></li><li>执行样本钝化。 <ol><li>使用高温计来监视温度设定样品温度至350℃。介绍1.3×10 -6毫巴超纯H 2到准备室使用泄漏阀。 <ol><li>把对H 2线非常接近系统中的一个泄漏阀冷阱，以进一步纯化的H 2。 </li><li>如果可能的话，泵系统与高速涡轮泵，而不是一个离子泵。这是为了让离子泵不被世博污染样品sed的高压力和排出的污染物。所述泵被放回正常状态大部分氢已被除去之后与样品仍是热的（350℃）。 </li></ol></li><li>打开钨氢裂化灯丝至1400℃下进行12分钟的温度，然后关闭灯丝和H 2气体流量。凉爽样品至室温。 </li></ol></li></ol> 3.扫描隧道显微镜和光刻<ol><li>样品转移到STM，并把样品和STM针尖进入隧道范围内。使用照相机与拆分比20μm的光斑尺寸更好的功率，利用针尖 - 样品结高分辨率光学图像。偏移校正和调整的光学图像，它代表的不失真再现基准标记。 </li><li>卸下所有的照明，以降低系统热不稳定性。确定的表面质量。 <ol><li>使用传统的STM技术与-2.25 V和200 pA的样本偏差，识别麻木尔的表面上的缺陷。 </li><li>如果表面缺陷均低于可接受的水平，移动到下一个步骤。可接受的最大缺陷水平如下:1％的悬挂键; 3％的Si空缺;的1％的污染物。 </li></ol></li><li>要生产设计的HDL型态，包括实验模式和大（1微米×1微米） 的SERP的识别模式。在SERP图案应与垂直于预期的原子力显微镜快速扫描轴长轴矢量绘制，用15-20纳米的间距。骨折的总体格局基本成形状定义应用HDL条件时，其次是尖的路径。24 </li><li>使用矢量输出来自前一步骤中，执行使用HDL FE模式光刻对于大的地区时，7-9 V样值的偏差，1 nA的电流，和0.2 MC /厘米和AP模式光刻用于需要原子精度边缘的小区域或这些区域24 <ol><li>确定最佳AP模式光刻条件由PErforming HDL具有各种范围从2至4个nA的样品偏压条件范围从3.5至4.5伏，电流和线的剂量为2〜4 MC /厘米。选择产生最窄完全取消钝化线的条件。 </li></ol></li><li>执行STM计量上所需的高密度脂蛋白形成图案的区域通过成像在-2.25 V样值偏差和0.2 nA的隧道电流。 <ol><li> [可选]进行纠错。 STM计量后，比较在STM图像与来自步骤3.5的所需图案去钝化图案。如果任何区域显示悬空键的形成不足，重复光刻周期在这些领域。 </li></ol></li><li>完成STM HDL后，脱离样品尖，移动样品装入锁。 </li><li>宣泄和消除样本。在发泄着超纯N 2，通过与惰性，平的基底如蓝宝石清洁接触它保护样本。29后的表面保护，关闭阀门，以任何泵然后介绍尾气作为QUICKLY越好。从系统中删除样本。 </li></ol> 4.样品运输<ol><li>从负载锁定取出样品。从样品架释放样品，其中包括如果可能的话去除箔片障碍。使用聚四氟乙烯（或Ti）的镊子，将样品转运，保持样品的保护的前侧，试图保持大气暴露至小于10分钟。 </li><li>安装在盖样品和松散组装加压样本转运。冲洗与超纯氩1分钟。 在任何点不要疏散系统，或者可能会发生表面损伤。29最后，用Ar的一个小的正压力（〜50-100毫巴）密封样品转运使得样品保持稳定长达一个月。 </li></ol> 5.原子层沉积<ol><li>确保ALD是在适当的沉积温度（100℃）。慢慢增加，在ALD腔室中的氩气压力，直到大气压已经实现。 </li><li>打开ALD室。 </li><li>用一对聚四氟乙烯镊子抓住上边缘的样本的开放样品转运，并迅速转移到ALD室，然后关闭ALD处理室和清洗用氩气流在&lt;2×10 -1毫巴1小时脱气的压力样本。设置进程执行ALD的80次重复成长无定型氧化钛是2.8nm。 <ol><li>使用未修饰的商用的ALD系统在100-150℃的样品温度下，用四氯化钛（ 四氯化钛）和水（H 2 O）的前体在0.3毫巴和0.8毫巴的压力进行沉积与反应物，用的脉冲时间0.1秒和0.05秒，分别为27 </li><li>以下各气体脉冲，吹扫用Ar反应器，持续60秒，在0.2毫巴，以确保最小的背景沉积由于物理吸附的反应物。在这项工作中的掩模，80次ALD循环中使用在100℃下生长大约2.8纳米的无定型氧化钛。 </li></ol&gt; </li><li>慢慢地发泄ALD室与氩气和开放。重复步骤4.1和4.2的样品运输。 </li></ol> 6.原子力显微镜（AFM） <ol><li>保证按照制造商的协议的原子力显微镜的正确校准。打开样品转运，轻轻用镊子取出样品。 </li><li>从转运除去后，牢固地安装示例成使用机械安装方法的原子力显微镜，例如夹紧系统如果可能的话。聚焦AFM相机到样品上，并定位在样品表面上的基准标记对准针尖到基于在步骤3.2的光学计量的图案。 </li><li>确保AFM设置将显示高度和相位信息，并设置扫描尺寸为20至40微米的宽。搞针尖到样品。 </li><li>在使用最高分辨率的高度和相位信息，扫描，直到定位器模式区域被确定。放大到重新构图祗园和定位在其中的图像所需的区域。 </li><li>使用适当的图像质量和分辨率（通常最高可能）取所需的区域的图像。一旦所有期望区域都被扫描，脱开来自样品的小费。卸载样品。重复步骤4.1和4.2的样品运输。 </li></ol> 7.反应离子蚀刻<ol><li>寒意电容耦合的RIE反应器中，以-110℃，然后将样品加载到其前奏室和抽气至7.5×10 -6毫巴。 <ol><li>稳定的温度下进行3分钟。然后把煤气上的O 2流量在8 SCCM（每分钟标准立方厘米），氩在40 SCCM和SF 6在20 SCCM。 </li><li>使用150W的RF放电击等离子体，然后修改该气流以蚀刻为使用SF 6在52标准立方厘米和O 2在8标准立方厘米1分钟。这些气体有Si的相互作用将蚀刻在约20nm / min的速率。30 </sup&gt; </li><li>泵真空至7.5×10 -6毫巴。排气系统RIE。重复步骤4.1和4.2的样品运输。 </li></ol></li></ol> 8.扫描电子显微术（SEM） <ol><li> SEM样品放置和样品引入到系统中。 <ol><li>将非粘性样品安装到一个方便的位置，以方便安装示例。 </li><li>打开样品转运，轻轻用镊子的边缘抢样品，安全地安装到SEM卡口，然后介绍样品组装成SEM样品取出。 </li><li>发泄和开放的SEM室。牢固安装样品组装的SEM样品台。抽空SEM室。 </li></ol></li><li>定位基准。 <ol><li>把放大倍数最低值。选择加速电压和束流的设置，将提供良好的解决方案。先从最低可接受的设置。上去需要。 </li><li>转电子束上。带给广大区域感兴趣的推荐工作距离和eucentric高度。 </li><li>找到并专注于1.1的基准。调整工作距离是必要的。优化聚焦，亮度和对比度。 </li></ol></li><li>定位和图像模式。 <ol><li>相对于基准，定位基于3.2节和第6的原子力显微镜测量的光学测量为了尽量减少对模式的积碳，用附近的非必要功能，优化对焦模式。一旦优化，移动到图案，并获得平面图图像和测量。 </li><li>如果需要的话，倾斜的样品的3D图像和图案高度的测量。对于其他模式，从8.3根据需要重复。 </li></ol></li><li>进行SEM系统结算例程和卸载样本/秒，规定由SEM制造商。样品固定回转运。 </li><li>重复步骤4.3和4.4的样品运输和储存。此时，样品是健壮和可存放的时间无限期。执行后成像分析，如果有必要的。 </li></ol>

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The authors have nothing to disclose.

上面所描述的纳米结构进行计量要求弥合期间使用其他工具如原子力显微镜和SEM HDL和图案位置的前端定位的能力。与此相反，以具有高分辨率位置编码其它发达构图工具，如电子束光刻，在这里进行的高密度脂蛋白，用一个STM进行而得到很好的控制粗定位，所以额外位置识别的协议被使用， 如图3首先，一个长焦距显微镜定位在超高真空系统从针尖 - 样品的结约20cm外。样品被构图为10微米宽的线条，1微米深的正方形网格，在500微米的间距，以方便识别表面上的末端定位的。 <img alt="图5" src="/files/ftp_upload/52900/52900fig5.jpg" /> SAMP图5.模式图像位置<html>乐。（A） 的 STM针尖（左）和它的反射（右）中的硅（100）表面上用500微米的节距线图案的样品的一个区域的光学图像。该线是1微米深，10微米宽之前特高压处理。引导线被包括以示出的线的方向。 （B）的特写，尖端（左下方）的抗扭斜的光学图像和它的反射（右上）。尖端和它的倒影之间的中心点位置确定的500微米×500微米的基准正方形内C:用50微米的斑点图案位置的特写镜头包括了规模D:5微米×5微米AFM整个图案区域的图像。ALDË后:1微米定位器模式之一的×1微米的SEM图像RIE后<a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/52900/52900fig5large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> e_content"&gt;第一个步骤，以定位纳米结构是确定这是使用长工作距离显微镜实现在这种情况下，表面上的尖 ​​端位置，32,33。 图5A示出了尖端的光学图像时与样品接合，同虚线加到引导读者为基准网格的方向。为了定位针尖/样品结的光学图像unskewed使一个正方形网格， 如图5B所示 ，虽然在样品的高温处理错误由于显著表面原子的迁移，这降低了深度和基准网格的可视性成像这里，增加了不确定性的前端位置。32虽然已经示出先前在高温样本处理将引起显著原子尺度表面重建，所述这里使用的网格间距足够大了在该平的中间的表面重建影响不大由网格uared限定。34然而，附近的图案的区域的边缘，台阶聚束确实由于光学成像在倾斜角度相对于表面的执行发生不对称即取决于电流流动的方向样品制备过程中。34在高度上的沟槽相对于其它一个的一侧的小变化会引起位置，特别是当与计划相比视点摄像如AFM或正常的SEM在图案附加的不确定性。后的前端接合的样品，再加上约20微米后处理基准线宽的结果在±27微米的图案位置识别的近似不确定性显微镜的10微米的焦斑大小。这定义了搜索窗口用于使用各种技术进行图案识别。 为了方便的小10-100nm的特征的位置，附加的大SERP中加入邻近所述纳米级的图案，一š 如图5B中所示。这些800纳米* 800纳米SERP中使用FE模式与HDL垂直线和各15nm的间隙写。通过对准的AFM快速扫描方向垂直于所述SERP线（ 即，水平扫描），这些模式往往显示出高对比度的AFM相位图像中，由于地形的高空间频率，进一步促进图案位置。一旦这些模式被发现，它变得更容易找到它们放置具有相对于大的型态约100nm精度较小的纳米级图案。 对于此纳米结构制造过程中，样品经历每个主要过程步骤之间大气暴露后的HDL已经执行，如在图1示意性示出。鉴于这一点，就必须确保该样品不降低在处理的任何一点。如上图所示，存在的背景沉积D A有限数量uring ALD，其被假定为种子上背景缺陷点31因此，处理不当如扩展气氛曝光会增加背景缺陷的数量，降低了表观ALD选择性。一个附加的表面降解机理可发生排气从UHV装载锁定于大气条件下样品的过程中。29为了缓解这一问题，将其安装在在特高压的线性致动器的弹簧加载的蓝宝石芯片使接触到125微米厚的样品放置箔接触样品，以防止表面劣化。一旦样品是在大气条件下，悬空键积累率仍然很低（ 即，&lt;0.1％/小时），进行至少几个小时，因此，只要将样品插入到一个稳定的环境中，例如超纯水的Ar内不到1小时，额外的背景沉积表面损伤应保持低。在这一点上，应当指出的是，样品不应为stored在真空环境中，因为这需要额外的排气/抽空循环，增加表面损坏的可能性。此HDL和ALD之间时间是在该点处的采样是最敏感的，因为蚀刻掩模尚未得到应用。 ALD后，将样品仍然需要保护，但只是为了防止额外掩模生长因二氧化硅的形成，一个相对缓慢的过程。 在图4所示的各模式中，高密度脂蛋白除去&gt; 80％的图案的中心内的背景H号，具有空间滚降在激活操作的效率，该行的边缘为止。24由于限制的非常有限的ALD上完全去钝化图案（ 图3）的背景和孵化自由生长，富裕模式图案的边缘，其中有从充分有效HDL和没有高密度脂蛋白的过渡，显示的ALD掩模生长的效力的一个过渡。在低于70％的H去除高密度脂蛋白是哪里这个过渡开始发生，这表明在何处部份掩模沉积发生的FE模式线的每侧上的〜2纳米的近似区域。35此外，ALD生长发生在一个"蘑菇"方式，36进一步拓宽掩模相对的到高密度脂蛋白模式，以便为2.8纳米的由该量拓宽任何掩模特征的掩模。总之，ALD线宽可以表示为W M = W 坐在 + F（δH）+ M其中W m是总宽度W 坐是其中的HDL已经饱和，除去的&gt; 70％的线的宽度表面H中，f（δH）为额外的宽度，由于在每个点由于与H残留在表面上的密度的生长，而M是由于生长的磨菇状的附加 ​​线宽。 δH取决于空间距离从饱和边缘高密度脂蛋白的图案，所以F（δH）为f（r）的 ，因为有空间的高密度脂蛋白的依赖性。这些条款，W 坐在发挥整体线宽的主要作用，而其他条款确定的滚降线边缘的程度。 与最终的纳米结构制造中，ALD的掩模本身并不能确定总的特征尺寸。取而代之的是，图案尺寸取决于掩模下的衬底的侵蚀程度。总蚀刻线宽被表示为W T = W M -宽E = W 坐在 + F（r）的+ M -宽E，其中W e表示侵蚀线宽，或图案尺寸减小由于蚀刻工艺。这取决于除其他事项外，蚀刻掩模的上述用于W M的厚度和质量。 F或其中线宽简单地要求除去掩模蚀刻发生之前，在宽 E项为零，但可以观察到有蚀刻相对于掩模形状后的变形的特征尺寸，这表明更复杂动力学是的情况下在作怪。 确定线宽限制的元素，W 坐在停止出现相同批量的ALD生长之前，可以降低至〜4nm的最小宽度35的其它元件中的蘑菇生长的效果，M（并因此W M） ，只能减少，如果总的膜厚度减小时，与蚀刻后的总纳米结构高度相关。的谱线增宽由于空间h的剩余的表面上的密度的依赖性效应中，f（δH），可以减少到几乎为零通过使用产生高密度脂蛋白线的多模的HDL具有可忽略林边缘ê边缘滚降。24为了证明这种减少F（δH）的效果， 图6示出了使用多模的HDL产生平方的图案阵列。阵列包括具有7纳米，14纳米，并从顶部21纳米至底部，并为7nm，14纳米和21纳米内的HDL开口尺寸的HDL线宽的图案从左到右。虽然是多模的HDL底部行中的轻微未对准，沿顶行的登记是精确到&lt;1纳米。 RIE后，线保持完好，主要为5纳米宽有两个小瑕疵，和线之间的开口解析所有的7纳米孔勉强分辨使用这种计量工具的模式。 <img alt="图6" src="/files/ftp_upload/52900/52900fig6.jpg" /> 图6.线宽和holewidth测试。使用多模写HDL高密度脂蛋白箱（ 一 ）STM。该linewidt行的h是21纳米，14纳米，并从底部7nm至顶端，分别与各列的holewidth为7纳米，14纳米，从左至右分别为21nm。 ALD和RIE后的同一模式（B）SEM。 <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/52900/52900fig6large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> 这个过程的最终极限取决于ALD工艺中，高密度脂蛋白，掩模蚀刻的电阻的质量的选择性和所需的特征形状自身。方法基于化学和背景的缺陷缓解上面已经讨论，以提高选择性。以前已经认为留在图案化的区域ħ缺陷减少掩模增长的质量，从而蚀刻电阻所示。35同样，缺乏仔细地控制图案化的线边缘的结果的掩模"滚降"，或过度牛逼hinning沿着图案的边缘，其作用如同一个邻近效应防止图案紧密放置掩模。幸运的是，蚀刻过程的选择性取决于荫罩厚度，所以对于在背景或缺陷沿图案边缘寄生沉积的净效果是小的。此外，对于结构短于20nm，更薄的掩模层将可能是可能的。由于ALD生长蘑菇的方式出现，由于较短的结构更薄的面具将导致更好的横向控制和比这里展示了更小的特征。而最终的特征尺寸的减少是不知道这个过程，肯定有的向下扩展可能。 而扫描电镜测量叶有关的特征尺寸和定位的不确定性，在图1的顶部描述的第一计量步骤给出关于作为写入的高密度脂蛋白图案原子精度。自所述Si（100）-H表面由一个版本的Ý定期晶格，并且由于STM可以以非破坏性成像模式下操作，所述的HDL图案可以而不引起进一步的表面损坏或进一步图案化，与此相反，如电子束光刻等技术成像。与不变的Si（100）晶格的原子尺度成像中，STM计量消除了定位的不确定性相关的原子力显微镜和SEM计量步骤的最大部分。在图6B中的方框阵列出现偏斜，例如。同的STM给阵列中的特征位置的原子精度的高分辨率测量，表观歪斜时，可以确认是由于SEM成像伪影。此外，在阵列的特征之间的高度精确的已知间隔，一个额外的校准不确定度相对于在SEM图像线宽被消除。 这份手稿描述了利用扫描隧道显微镜的原子精度的纳米加工方法基于氢去钝化光刻（HDL）。高密度脂蛋白产生化学反应性图案上的Si（100）-H表面，其中二氧化钛的原子层沉积产生具有一个横向尺寸的局部蚀刻掩模证实到低于10纳米。然后反应离子蚀刻将HDL图案转移到衬底中，使得以高精度横向控制为17nm高大图案。为了达到这些结果，样品必须通风和仪器之间传送期间被保护。仔细对照样品处理，纳米结构具有可追溯性的原子晶格可与制造原子精度的位置和〜1纳米的尺寸精度。

由于纳米技术变得在各种各样领域，认识结构更重要形成增益重要性，特别是在光刻和电子领域。强调计量的重要性在纳米尺度，特别在低于10纳米尺度，但是应当指出，在仅1纳米的特征尺寸的变化表示的分数变化至少10％。该变型可以具有对器件的性能和材料性质显著影响1,2 - 。4使用合成方法，非常精确地形成单独的特征，例如量子点或其它复杂分子可被制造，2,5,6-但通常缺乏相同精度在功能布局和方向，尽管为了提高大小和位置的控制工作。本文阐述的用于制造纳米结构邻近的原子尺寸精度和特征放置原子精度，以及一种方法在功能布局原子计量。使用扫描隧道显微镜（STM）的诱导氢取消钝化光刻（HDL）的原子精度，以原子精确图案与化学敏感的对比度形成在一个表面上。选择性原子层沉积（ALD），然后施加一个硬质的氧化物材料中的图案化的区域，用反应离子蚀刻（RIE）最终转印图案到散装物料，如在图1示意性示出。与标准相结合的高度精确的HDL过程ALD和RIE处理的结果以灵活的方法，以产生纳米结构上以任意形状和定位的表面。 <img alt="图1" src="/files/ftp_upload/52900/52900fig1.jpg" /> 图1.原发性纳米制造工艺步骤。作为一个例子，一个200纳米×200平方纳米被示出。每个圆圈的箭头表示大气暴露和t的步骤站点之间ransport。特高压后，样品制备，样品是用特高压HDL其次是STM计量（左上）图案。 ALD然后进行，接着用AFM测量（右）。 RIE转成图案的Si（100），其次是SEM计量（左下）。 <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/52900/52900fig1large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> 最精确的光刻迄今为止通常涉及扫描探针技术，具体地基于STM的图案化，其中原子分辨率的图案化和官能化已被证明对于许多应用7以前，原子操纵已生产纳米结构的最终精度通过使用单个原子作为构建块，8 ，9,10，但需要在低温条件，从而纳米结构缺乏长期稳定性。 RT原子操纵通过除去从表面的氢原子已被示出，specificalLY高密度脂蛋白。11,12,13的HDL有望使新的类的基础上，表面处理的对比空间定位电子和其他设备。使用的HDL，而不进一步处理，不同的器件架构是可能的，包括悬挂键合线或逻辑器件。14,15,16除了提供电相反，高密度脂蛋白可引入其中，所述钝化H膜层已被除去的表面上的化学对比，在效果创建用于进一步化学修饰的模板。这种化学修饰已被证明在硅和其它表面，显示出对金属，17绝缘体18，甚至半导体的沉积选择性。16,19这些例子都产生二维结构，因此其它处理步骤，必须使用以产生真正的三三维结构的原子分辨控制由高密度脂蛋白承诺。此前，这需要重复图案，19,20,21退火，22 </suP&gt;或更少的很好的解决方法，如尖为基础的电子束诱导沉积。23 类似于电子束光刻，高密度脂蛋白使用电子的局部的磁通，以暴露抗蚀剂。有几个相似之处存在，如与临场变盘的大小和图案效率进行多模式光刻技术的能力。24然而，高密度脂蛋白的真正动力源于它是如何不同于电子束光刻。首先，抗蚀剂中的HDL是氢原子的单层以便抗蚀剂曝光成为数字过程;抗蚀原子或者是或不存在。25由于氢原子的位置对应于底层的Si（100）晶格HDL的过程可以是一个原子精确的过程，尽管应当注意的是，在本文所述的HDL具有纳米精度反对具有原子完美，因此不是数字在这种情况下。由于在高密度脂蛋白的电子源是本地到表面，STM操作的各种模式促进两者吞吐量的优化以及错误检查。在低于〜4.5 V针尖样的偏见，光刻可以在以原子精度，被称为以原子的精确模式（AP模式）的单个原子水平上进行。与此相反，在偏压以上〜7伏，电子直接从尖端到具有宽线宽并高去钝化效率，这里被称为场发射模式（FE模式）样品发出。 HDL吞吐量然后，可以通过仔细组合这两种模式进行优化，虽然整体的吞吐量保持小相对于电子束光刻用构图高达1微米2 /分钟的可能。当偏置被颠倒，使得样品保持在〜-2.25伏，电子隧道从样品到尖端极低激活操作效率，从而使该表面的原子结构的检查既用于纠错和原子级计量。 在图1中所示的该纳米结构物的制造工艺</strong&gt;的用UHV-HDL的步骤开始时，如上所述。以下的HDL，将样品排放到大气中，在该时间所述图案化的区域变得饱和与水，形成一个薄的（ 即，〜1单层）SiO 2层26中传输后，将样品插入到一ALD室，用于沉积二氧化钛（TiO 2的），其厚度约2-3纳米这里沉积，如通过AFM和XPS 27由于二氧化钛反应取决于表面的水饱和度测量，该方法是可能的，尽管这浸透表面与水的气氛曝光。接着，在该ALD掩模图案转移到散装使用的RIE，使硅为20nm除去样品进行蚀刻，用原子力显微镜和SEM测定的蚀刻深度。为了便于计量步骤，在Si（100）晶片图案化有其目的是特高压制备由长工作距离的光学显微镜，原子力显微镜俯视光学成像后是可见的网格线，和低倍率俯视SEM图像。为了帮助识别纳米级结构，1微米2蛇形图案（ 养老金计划 ）进行构图到样品与位于相对于养老金计划固定位置最偏远的纳米图案。 高密度脂蛋白，选择性ALD，和RIE的这种组合可以是用于纳米结构制造的一个重要的过程，它包括在原子尺度计量作为该过程的一个天然副产品。下面，我们包括涉及制造亚10纳米的纳米结构中的Si（100），使用高密度脂蛋白，选择性ALD，和RIE步骤的详细描述。假定一个是本领域技术人员在这些方法中，但信息将包含有关如何对各种处理进行集成。特别强调将给予由作者，以防止同样的困难经历的那些意想不到的困难，特别是涉及到运输和计量。

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			<td>VA Semiconductor</td>
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			<td>Acetone</td>
			<td>Alfa Aesar</td>
			<td>19392</td>
			<td>Semiconductor Grade, 99.5%</td>
		</tr>
		<tr>
			<td>Argon</td>
			<td>Praxair</td>
			<td></td>
			<td>Ultra high purity (grade 5.0)</td>
		</tr>
		<tr>
			<td>Deionized water</td>
			<td>Millipore</td>
			<td>Milli-Q Water Purification System</td>
			<td>&#62;18 MW resistance water produced on demand.</td>
		</tr>
		<tr>
			<td>TiCl4</td>
			<td>Sigma Aldrigh</td>
			<td>254312</td>
			<td>&#8805;99.995% trace metals basis</td>
		</tr>
		<tr>
			<td>O2</td>
			<td>Matheson</td>
			<td>G2182101</td>
			<td>Research Grade</td>
		</tr>
		<tr>
			<td>SF6</td>
			<td>Matheson</td>
			<td>G2658922</td>
			<td>Ultra high purity (grade 4.7)</td>
		</tr>
		<tr>
			<td>Blue Medium Tack Roll</td>
			<td>Semiconductor Equipment Corporation</td>
			<td>18074</td>
			<td>Thickness 75 um / .003&#8221;&#160; Length 200 M / 660&#8217;&#160;</td>
		</tr>
	</tbody>
</table>

atomically traceable nanostructure fabrication

Reducing the scale of etched nanostructures below the 10 nm range eventually will require an atomic scale understanding of the entire fabrication process being used in order to maintain exquisite control over both feature size and feature density. Here, we demonstrate a method for tracking atomically resolved and controlled structures from initial template definition through final nanostructure metrology, opening up a pathway for top-down atomic control over nanofabrication. Hydrogen depassivation lithography is the first step of the nanoscale fabrication process followed by selective atomic layer deposition of up to 2.8 nm of titania to make a nanoscale etch mask. Contrast with the background is shown, indicating different mechanisms for growth on the desired patterns and on the H passivated background. The patterns are then transferred into the bulk using reactive ion etching to form 20 nm tall nanostructures with linewidths down to ~6 nm. To illustrate the limitations of this process, arrays of holes and lines are fabricated. The various nanofabrication process steps are performed at disparate locations, so process integration is discussed. Related issues are discussed including using fiducial marks for finding nanostructures on a macroscopic sample and protecting the chemically reactive patterned Si(100)-H surface against degradation due to atmospheric exposure.

在这里所描述的情况下，高密度脂蛋白是使用多模光刻进行。24在FE模式，具有8 V样品偏压，1 Na和0.2 MC /厘米（相当于50毫微米/秒尖端速度）进行，尖端移过的表面平行或垂直于硅晶格，产生激活操作的行。虽然这种线形很尖依赖，在这里的情况下，线的完全去钝化部分约为6纳米宽，具有部分去钝化延伸的线两侧另一个为2nm的尾巴。当高精细图案需要，可以使用4 V样值的偏差，4 nA的，和4 MC /厘米（相当于10毫微米/秒尖端速度）进行AP模式光刻技术。每个模式的AP模式分量的程度取决于所述部分去钝化图案使用FE模式产生的宽度。参见图2的图案在Si STM图像的实例（100）-H为不同的HDL模式。 图2A示出一个小Pattern产生只使用AP模式的HDL。 图2B是使用多模光刻写入的图案，其中该有限元模式系为约6纳米宽的例子，但写在一个10纳米的间距，以大约2纳米的每个边缘的使用AP模式HDL编写的。在图案的内部对FE模式部分写在10nm的间距，因此有内，其中高密度脂蛋白是不完整的图案窄的区域。对于大型的，不精确的图案的FE模式可以单独使用，如在图2C中 ，其中约1微米2 SERP图案写在一个20纳米的间距。 <img alt="图2" src="/files/ftp_upload/52900/52900fig2.jpg" /> 图2.代表性的HDL图案。写入AP模式光刻4V的，4 nA的，和4 MC /厘米（10毫微米/秒）的高密度脂蛋白图案的（A）中的STM图像。 （B）的万亩STM图像使用的AP模式和FE模式（8V，1 nA的，0.2 MC /厘米）的组合LTI模式HDL模式写入。有限元模式线间距被选择为比写入线宽稍大改善书面使用的矢量的能见度。 （C）FE模式的大定位SERP写在一个20纳米的间距的光刻技术。 <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/52900/52900fig2large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> 因此，在使用原子精确的HDL图案，以达到最佳掩模生产，选择性的高度必须是可能的。此前，ALD选择性已经研究用XPS等方法分别对无图案的Si（100）-H和Si（100）比较沉积-SiO x表面作为类似物的无图案和形成图案的区域，。27,31使用原子力显微镜（AFM），我们观察到类似的结果， 如图3 </strong&gt;。为200nm×200毫微米见方的图案化到硅（100）-H用&gt; 90％的氢气的图案内移除，然后二氧化钛上沉积的图案。相比于背景的图案的AFM分析表明，存在于图案比对背景最高缺陷的高度增长的更高一层。为导通图案和背景沉积生长曲线外推表明相同的生长速率，但以20次循环的最高背景生长的孵育。大部分增长的背景发生了更长的培养时间值得重申在这里。如上所述，所述Ar吹扫步骤是非常重要的，以实现选择性，因为它有助于去除物理吸附的前体。初步的结果与其它二氧化钛前体，如四（二甲氨基）钛，表现出更多的背景反应性，可能是​​因为前体物理吸附过强于Si（100）-H表面。为了防止后台adsorption，仔细注意的前体的化学是非常重要的。 <img alt="图3" src="/files/ftp_upload/52900/52900fig3.jpg" /> 图3.选择性沉积。（A）样品AFM图像的图案和背景区TiO 2的沉积。沉积反应在100℃。 （B）沉积深度对不同数量的周期。的十字代表的高度由生长的原子力显微镜"上图案"相对于背景测量。开放的圆圈表示高度由最高的背景沉积AFM为200nm附近有图案的面积×200纳米的范围内为衡量标准。 <a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/52900/52900fig3large.jpg" target="_blank">请点击此处查看该图的放大版本。</a> 因为它有可能沉积在高密度脂蛋白patteRNS，对图形特征的限制调查应进行检查。虽然已经表明，ALD产生扩大相对于HDL图案的图案，并且该蚀刻结构略微收缩相对于掩模，产生高密度阵列的效果仍然有些没有得到解决。 图4示出了高密度脂蛋白，二氧化钛掩模，以及用于正方形阵列蚀刻结构使用写在15nm的节距的FE模式的HDL线制成。在图4A中 ，高密度脂蛋白图案示出了两个SERP中 -酮，相对于90度旋转的其它写与一个8 V针尖-样品偏压，1 nA的电流，和0.2 MC /厘米的剂量（或50毫微米/秒尖端速度） 。明显有不同大小的图案的开口。内的开口本身，一些HDL已经发生，但它仍然是低于20％的H去除的顺序。 图4B示出的掩模沉积后的同一图案的AFM图像。由于小费卷积和化效果，在图案开口是难以解决的。然而，明确的顺序是可观察的。 图4C是RIE后相同的图案的SEM图像。约60％的所需开口确实转移到衬底，表明该图案的大小和密度大约是限制使用有限元模式的HDL有效纳米结构物的制造。 <img alt="图4" src="/files/ftp_upload/52900/52900fig4.jpg" /> 图4阵列的开口。HDL（一 ）STM使用FE模式下，行写。两个蛇形图案，以相对于彼此旋转90度，进行​​写入，10nm的节距。 （B）的 AFM图像后的相同的图案的TiO 2的ALD 2.8纳米。 "洞"后阵RIE（三）SEM除去硅20纳米。注意到某些"洞"未能蚀刻。<a href="https://www-jove-com.remotexs.ntu.edu.sg/files/ftp_upload/52900/52900fig4large.jpg" target="_blank">请点击此处查看该图的放大版本。</a>

Watch this Scientific Journal Video about Atomically Traceable Nanostructure Fabrication at JoVE.com

Atomically Traceable Nanostructure Fabrication

We report a protocol for combining the atomic metrology of the Scanning Tunneling Microscope for surface patterning with selective Atomic Layer Deposition and Reactive Ion Etching. Using a robust process involving numerous atmospheric exposures and transport, 3D nanostructures with atomic metrology are fabricated.

原子纳米结构可追溯制造

Reducing the scale of etched nanostructures below the 10 nm range eventually will require an atomic scale understanding of the entire fabrication process ...

atomically-traceable-nanostructure-fabrication

Nanyang Technological University

Research

JoVE Journal

Engineering

8.6K 次观看.  Zyvex Labs. We report a protocol for combining the atomic metrology of the Scanning Tunneling Microscope for surface patterning with selective Atomic Layer Deposition and Reactive Ion Etching. Using a robust process involving numerous atmospheric exposures and transport, 3D nanostructures with atomic metrology are fabricated. 

视频: Atomically Traceable Nanostructure Fabrication

Fabrication of Silica Ultra High Quality Factor Microresonators

Whispering gallery resonant cavities confine light in circular orbits at their periphery.1-2 The photon storage lifetime in the cavity, quantified by the quality factor (Q) of the cavity, can be in excess of 500ns for cavities with Q factors above 100 million. As a result of their low material losses, silica microcavities have demonstrated some of the longest photon lifetimes to date1-2. Since a portion of the circulating light extends outside the resonator, these devices can also be used to probe the surroundings. This interaction has enabled numerous experiments in biology, such as single molecule biodetection and antibody-antigen kinetics, as well as discoveries in other fields, such as development of ultra-low-threshold microlasers, characterization of thin films, and cavity quantum electrodynamics studies.3-7
The two primary silica resonant cavity geometries are the microsphere and the microtoroid. Both devices rely on a carbon dioxide laser reflow step to achieve their ultra-high-Q factors (Q&gt;100 million).1-2,8-9 However, there are several notable differences between the two structures. Silica microspheres are free-standing, supported by a single optical fiber, whereas silica microtoroids can be fabricated on a silicon wafer in large arrays using a combination of lithography and etching steps. These differences influence which device is optimal for a given experiment.
Here, we present detailed fabrication protocols for both types of resonant cavities. While the fabrication of microsphere resonant cavities is fairly straightforward, the fabrication of microtoroid resonant cavities requires additional specialized equipment and facilities (cleanroom). Therefore, this additional requirement may also influence which device is selected for a given experiment.
Introduction
An optical resonator efficiently confines light at specific wavelengths, known as the resonant wavelengths of the device. 1-2 The common figure of merit for these optical resonators is the quality factor or Q. This term describes the photon lifetime (&tau;o) within the resonator, which is directly related to the resonator's optical losses. Therefore, an optical resonator with a high Q factor has low optical losses, long photon lifetimes, and very low photon decay rates (1/&tau;o). As a result of the long photon lifetimes, it is possible to build-up extremely large circulating optical field intensities in these devices. This very unique property has allowed these devices to be used as laser sources and integrated biosensors.10
A unique sub-class of resonators is the whispering gallery mode optical microcavity. In these devices, the light is confined in circular orbits at the periphery. Therefore, the field is not completely confined within the device, but evanesces into the environment. Whispering gallery mode optical cavities have demonstrated some of the highest quality factors of any optical resonant cavity to date.9,11 Therefore, these devices are used throughout science and engineering, including in fundamental physics studies and in telecommunications as well as in biodetection experiments. 3-7,12
Optical microcavities can be fabricated from a wide range of materials and in a wide variety of geometries. A few examples include silica and silicon microtoroids, silicon, silicon nitride, and silica microdisks, micropillars, and silica and polymer microrings.13-17 The range in quality factor (Q) varies as dramatically as the geometry. Although both geometry and high Q are important considerations in any field, in many applications, there is far greater leverage in boosting device performance through Q enhancement. Among the numerous options detailed previously, the silica microsphere and the silica microtoroid resonator have achieved some of the highest Q factors to date.1,9 Additionally, as a result of the extremely low optical loss of silica from the visible through the near-IR, both microspheres and microtoroids are able to maintain their Q factors over a wide range of testing wavelengths.18 Finally, because silica is inherently biocompatible, it is routinely used in biodetection experiments.
In addition to high material absorption, there are several other potential loss mechanisms, including surface roughness, radiation loss, and contamination loss.2 Through an optimization of the device size, it is possible to eliminate radiation losses, which arise from poor optical field confinement within the device. Similarly, by storing a device in an appropriately clean environment, contamination of the surface can be minimized. Therefore, in addition to material loss, surface scattering is the primary loss mechanism of concern.2,8
In silica devices, surface scattering is minimized by using a laser reflow technique, which melts the silica through surface tension induced reflow. While spherical optical resonators have been studied for many years, it is only with recent advances in fabrication technologies that researchers been able to fabricate high quality silica optical toroidal microresonators (Q&gt;100 million) on a silicon substrate, thus paving the way for integration with microfluidics.1
The present series of protocols details how to fabricate both silica microsphere and microtoroid resonant cavities. While silica microsphere resonant cavities are well-established, microtoroid resonant cavities were only recently invented.1 As many of the fundamental methods used to fabricate the microsphere are also used in the more complex microtoroid fabrication procedure, by including both in a single protocol it will enable researchers to more easily trouble-shoot their experiments.

We describe the use of a carbon dioxide laser reflow technique to fabricate silica resonant cavities, including free-standing microspheres and on-chip microtoroids. The reflow method removes surface imperfections, allowing long photon lifetimes within both devices. The resulting devices have ultra high quality factors, enabling applications ranging from telecommunications to biodetection.

硅胶超高品质因子微谐振器的制造

Whispering gallery resonant cavities confine light in circular orbits at their periphery.1-2 The photon storage lifetime in the cavity, quantified by the ...

科研

工程学

Simulation, Fabrication and Characterization of THz Metamaterial Absorbers

Metamaterials (MM), artificial materials engineered to have properties that may not be found in nature, have been widely explored since the first theoretical1 and experimental demonstration2 of their unique properties. MMs can provide a highly controllable electromagnetic response, and to date have been demonstrated in every technologically relevant spectral range including the optical3, near IR4, mid IR5 , THz6 , mm-wave7 , microwave8 and radio9 bands. Applications include perfect lenses10, sensors11, telecommunications12, invisibility cloaks13 and filters14,15. We have recently developed single band16, dual band17 and broadband18 THz metamaterial absorber devices capable of greater than 80% absorption at the resonance peak. The concept of a MM absorber is especially important at THz frequencies where it is difficult to find strong frequency selective THz absorbers19. In our MM absorber the THz radiation is absorbed in a thickness of ~ &lambda;/20, overcoming the thickness limitation of traditional quarter wavelength absorbers. MM absorbers naturally lend themselves to THz detection applications, such as thermal sensors, and if integrated with suitable THz sources (e.g. QCLs), could lead to compact, highly sensitive, low cost, real time THz imaging systems.

This protocol outlines the simulation, fabrication and characterization of THz metamaterial absorbers. Such absorbers, when coupled with an appropriate sensor, have applications in THz imaging and spectroscopy.

模拟，太赫兹超材料吸收器的制备与表征

Metamaterials (MM),  artificial materials engineered to have properties that may not be found in  nature, have been widely explored since the first ...

Fabrication of Spatially Confined Complex Oxides

Complex materials such as high Tc superconductors, multiferroics, and colossal magnetoresistors have electronic and magnetic properties that arise from the inherent strong electron correlations that reside within them. These materials can also possess electronic phase separation in which regions of vastly different resistive and magnetic behavior can coexist within a single crystal alloy material. By reducing the scale of these materials to length scales at and below the inherent size of the electronic domains, novel behaviors can be exposed. Because of this and the fact that spin-charge-lattice-orbital order parameters each involve correlation lengths, spatially reducing these materials for transport measurements is a critical step in understanding the fundamental physics that drives complex behaviors. These materials also offer great potential to become the next generation of electronic devices 1-3. Thus, the fabrication of low dimensional nano- or micro-structures is extremely important to achieve new functionality. This involves multiple controllable processes from high quality thin film growth to accurate electronic property characterization. Here, we present fabrication protocols of high quality microstructures for complex oxide manganite devices. Detailed descriptions and required equipment of thin film growth, photo-lithography, and wire-bonding are presented.

We describe the use of pulsed laser deposition (PLD), photolithography and wire-bonding techniques to create micrometer scale complex oxides devices. The PLD is utilized to grow epitaxial thin films. Photolithography and wire-bonding techniques are introduced to create practical devices for measurement purposes.

空间密闭的复合氧化物制备

Complex materials such as high Tc superconductors, multiferroics, and colossal magnetoresistors have electronic and magnetic properties that arise from ...

Fabrication of VB2/Air Cells for Electrochemical Testing

A technique to investigate the properties and performance of new multi-electron metal/air battery systems is proposed and presented. A method for synthesizing nanoscopic VB2 is presented as well as step-by-step procedure for applying a zirconium oxide coating to the VB2 particles for stabilization upon discharge. The process for disassembling existing zinc/air cells is shown, in addition construction of the new working electrode to replace the conventional zinc/air cell anode with a the nanoscopic VB2 anode. Finally, discharge of the completed VB2/air battery is reported. We show that using the zinc/air cell as a test bed is useful to provide a consistent configuration to study the performance of the high-energy high capacity nanoscopic VB2 anode.

Fabrication of VB2/Air Cells for Electrochemical Testing

A protocol is presented to study multi-electron metal/air battery systems by using previous technology developed for the zinc/air cell. Electrochemical testing is then performed on fabricated batteries to evaluate performance.

VB制作<sub&gt; 2</sub&gt; /空气电池电化学测试

A technique to investigate the properties and performance of new multi-electron metal/air battery systems is proposed and presented. A method for ...

Fabrication and Testing of Microfluidic Optomechanical Oscillators

Cavity optomechanics experiments that parametrically couple the phonon modes and photon modes have been investigated in various optical systems including microresonators. However, because of the increased acoustic radiative losses during direct liquid immersion of optomechanical devices, almost all published optomechanical experiments have been performed in solid phase. This paper discusses a recently introduced hollow microfluidic optomechanical resonator. Detailed methodology is provided to fabricate these ultra-high-Q microfluidic resonators, perform optomechanical testing, and measure radiation pressure-driven breathing mode and SBS-driven whispering gallery mode parametric vibrations. By confining liquids inside the capillary resonator, high mechanical- and optical- quality factors are simultaneously maintained.

Parametric optomechanical excitations have recently been experimentally demonstrated in microfluidic optomechanical resonators by means of optical radiation pressure and stimulated Brillouin scattering. This paper describes the fabrication of these microfluidic resonators along with methodologies for generating and verifying optomechanical oscillations.

制造和微流控光机振荡器测试

Cavity optomechanics experiments that parametrically couple the phonon modes and photon modes have been investigated in various optical systems including ...

Patterning via Optical Saturable Transitions - Fabrication and Characterization

This protocol describes the fabrication and characterization of nanostructures using a novel nanolithographic technique called Patterning via Optical Saturable Transitions (POST). In this technique the chemical properties of organic photochromic molecules that undergo single-photon reactions are exploited, enabling rapid top-down nanopatterning over large areas at low light intensities, thereby, allowing for the circumvention of the far-field diffraction barrier.4 Simple, cost-effective, high throughput and resolution alternatives to nanopatterning are being explored, such as, two-photon polymerization5,6, beam pen lithography (BPL)7, scanning electron beam lithography (SEBL), and focused ion beam (FIB) patterning. However, multi-photon approaches require high light intensities, which limit their potential for high throughput and offer low image contrast. Although, electron and ion beam lithographic processes offer increased resolution, the serial nature of the process is limited to slow writing speeds, which also prevents patterning of features over large areas. Beam-pen lithography is an approach towards parallel near-field optical lithography. However, the gap between the source of the beam and the surface of the photoresist needs to be controlled extremely precisely for good pattern uniformity and this is very challenging to accomplish for large arrays of beams. Patterning via Optical Saturable Transitions (POST) is an alternative optical nanopatterning technique for patterning sub-wavelength features1-3. Since this technique uses single photons instead of electrons, it is extremely fast and does not require high light intensities1-3, opening the door to massive parallelization.

We report that the diffraction limit of conventional optical lithography can be overcome by exploiting the transitions of organic photochromic derivatives induced by their photoisomerization at low light intensities.1-3 This paper outlines our fabrication technique and two locking mechanisms, namely: dissolution of one photoisomer and electrochemical oxidation.

通过光学吸收跃迁图案 - 制备与表征

This protocol describes the fabrication and characterization of nanostructures using a novel nanolithographic technique called Patterning via Optical ...

Fabrication and Characterization of Superconducting Resonators

Superconducting microwave resonators are of interest for a wide range of applications, including for their use as microwave kinetic inductance detectors (MKIDs) for the detection of faint astrophysical signatures, as well as for quantum computing applications and materials characterization. In this paper, procedures are presented for the fabrication and characterization of thin-film superconducting microwave resonators. The fabrication methodology allows for the realization of superconducting transmission-line resonators with features on both sides of an atomically smooth single-crystal silicon dielectric. This work describes the procedure for the installation of resonator devices into a cryogenic microwave testbed and for cool-down below the superconducting transition temperature. The set-up of the cryogenic microwave testbed allows one to do careful measurements of the complex microwave transmission of these resonator devices, enabling the extraction of the properties of the superconducting lines and dielectric substrate (e.g., internal quality factors, loss and kinetic inductance fractions), which are important for device design and performance.

Superconducting microwave resonators are of interest for detection of light, quantum computing applications and materials characterization. This work presents a detailed procedure for fabrication and characterization of superconducting microwave resonator scattering parameters.

制备与表征超导谐振器的

Superconducting microwave resonators are of interest for a wide range of applications, including for their use as microwave kinetic inductance detectors ...

Fabrication of 3D Carbon Microelectromechanical Systems (C-MEMS)

A wide range of carbon sources are available in nature, with a variety of micro-/nanostructure configurations. Here, a novel technique to fabricate long and hollow glassy carbon microfibers derived from human hairs is introduced. The long and hollow carbon structures were made by the pyrolysis of human hair at 900 &#176;C in a N2 atmosphere. The morphology and chemical composition of natural and pyrolyzed human hairs were investigated using scanning electron microscopy (SEM) and electron-dispersive X-ray spectroscopy (EDX), respectively, to estimate the physical and chemical changes due to pyrolysis. Raman spectroscopy was used to confirm the glassy nature of the carbon microstructures. Pyrolyzed hair carbon was introduced to modify screen-printed carbon electrodes ; the modified electrodes were then applied to the electrochemical sensing of dopamine and ascorbic acid. Sensing performance of the modified sensors was improved as compared to the unmodified sensors. To obtain the desired carbon structure design, carbon micro-/nanoelectromechanical system (C-MEMS/C-NEMS) technology was developed. The most common C-MEMS/C-NEMS fabrication process consists of two steps: (i) the patterning of a carbon-rich base material, such as a photosensitive polymer, using photolithography; and (ii) carbonization through the pyrolysis of the patterned polymer in an oxygen-free environment. The C-MEMS/NEMS process has been widely used to develop microelectronic devices for various applications, including in micro-batteries, supercapacitors, glucose sensors, gas sensors, fuel cells, and triboelectric nanogenerators. Here, recent developments of a high-aspect ratio solid and hollow carbon microstructures with SU8 photoresists are discussed. The structural shrinkage during pyrolysis was investigated using confocal microscopy and SEM. Raman spectroscopy was used to confirm the crystallinity of the structure, and the atomic percentage of the elements present in the material before and after pyrolysis was measured using EDX.

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS

Long and hollow glassy carbon microfibers were fabricated based on the pyrolysis of a natural product, human hair. The two fabrication steps of carbon microelectromechanical and carbon nanoelectromechanical systems, or C-MEMS and C-NEMS, are: (i) photolithography of a carbon-rich polymer precursor and (ii) pyrolysis of the patterned polymer precursor.

3D碳微机电系统（C-MEMS）的制造

A wide range of carbon sources are available in nature, with a variety of micro-/nanostructure configurations. Here, a novel technique to fabricate long ...

Fabrication of Periodic Gold Nanocup Arrays Using Colloidal Lithography

Within recent years, the field of plasmonics has exploded as researchers have demonstrated exciting applications related to chemical and optical sensing in combination with new nanofabrication techniques. A plasmon is a quantum of charge density oscillation that lends nanoscale metals such as gold and silver unique optical properties. In particular, gold and silver nanoparticles exhibit localized surface plasmon resonances-collective charge density oscillations on the surface of the nanoparticle-in the visible spectrum. Here, we focus on the fabrication of periodic arrays of anisotropic plasmonic nanostructures. These half-shell (or nanocup) structures can exhibit additional unique light-bending and polarization-dependent optical properties that simple isotropic nanostructures cannot. Researchers are interested in the fabrication of periodic arrays of nanocups for a wide variety of applications such as low-cost optical devices, surface-enhanced Raman scattering, and tamper indication. We present a scalable technique based on colloidal lithography in which it is possible to easily fabricate large periodic arrays of nanocups using spin-coating and self-assembled commercially available polymeric nanospheres. Electron microscopy and optical spectroscopy from the visible to near-infrared (near-IR) was performed to confirm successful nanocup fabrication. We conclude with a demonstration of the transfer of nanocups to a flexible, conformal adhesive film.

We demonstrate the fabrication of periodic gold nanocup arrays using colloidal lithographic techniques and discuss the importance of nanoplasmonic films.

用胶体光刻制备周期性金 Nanocup 阵列

Within recent years, the field of plasmonics has exploded as researchers have demonstrated exciting applications related to chemical and optical sensing ...

Fabrication of Superhydrophobic Metal Surfaces for Anti-Icing Applications

Several ways to produce superhydrophobic metal surfaces are presented in this work. Aluminum was chosen as the metal substrate due to its wide use in industry. The wettability of the produced surface was analyzed by bouncing drop experiments and the topography was analyzed by confocal microscopy. In addition, we show various methodologies to measure its durability and anti-icing properties. Superhydrophobic surfaces hold a special texture that must be preserved to keep their water-repellency. To fabricate durable surfaces, we followed two strategies to incorporate a resistant texture. The first strategy is a direct incorporation of roughness to the metal substrate by acid etching. After this surface texturization, the surface energy was decreased by silanization or fluoropolymer deposition. The second strategy is the growth of a ceria layer (after surface texturization) that should enhance the surface hardness and corrosion resistance. The surface energy was decreased with a stearic acid film.
The durability of the superhydrophobic surfaces was examined by a particle impact test, mechanical wear by lateral abrasion, and UV-ozone resistance. The anti-icing properties were explored by studying the ability to repeal subcooled water, freezing delay, and ice adhesion.

We illustrate several methodologies to produce superhydrophobic metal surfaces and to explore their durability and anti-icing properties.

防结冰用超疏水性金属表面的制备

Several ways to produce superhydrophobic metal surfaces are presented in this work. Aluminum was chosen as the metal substrate due to its wide use in ...